This application report helps TI mmWave Radar sensor designers navigate the series of tasks and key concerns when designing, manufacturing and validating a new mmWave sensor board. This document is only concerned with the RF portions of the design. It is beneficial for PCB designers that do not have experience with RF PCB design at mmWave frequencies. This document is applicable to sensor designs using IWR/ AWR mmWave Radar chips.

Large-screen HDTVs are selling in huge volumes over last few years, primarily driven by amazing improvements in picture quality & form factor (thinner screens). The form factor constraints from having skinny screens result in tiny built-in speakers that are undersized, under-powered and are typically aimed at wrong direction. Hence sound bars have exploded in popularity as complementary audio system by providing a sound experience that more closely matches the TV’s life-like pictures. In addition, with release of HDMI 2.1 specification we finally have a no compromise audio solution for HDMI as part of the eARC [enhanced Audio Return Channel]. One of the most important functions the eARC enables is sending audio signal both “upstream” and “downstream” over a single connection. As a result, with eARC the full resolution sound signals can be passed back and forth between your TV and audio systems with ease and without compromising sound quality.

With vehicle electrification increasing and as fully electric vehicles become more mainstream, the number of electric motors and digital power control systems in automobiles are expanding. Many of these systems require high-speed current monitoring circuits to ensure proper operation and to protect against potentially damaging overcurrent conditions. One of the most effective ways to accomplish this function is to employ a low side current shunt monitoring circuit.

A myriad of audio input sources including CD/DVD radio aux input streaming music Bluetooth® audio navigation alerts and other notifications routed to multiple output pl

The requirements for operational amplifiers and other ICs used in motor control systems have increased because of the need to extract higher performance from a motor while maintaining low system cost. Measuring motor current is an easy and inexpensive way to understand the torque and direction of the motor, so current sensing forms the backbone of many common motor control schemes for the three common DC motor types: stepper, brushed DC and brushless DC (BLDC).

This application report discusses the Memory Power-On Self-Test (M-POST) feature available in select series of C2000 real-time controllers. The M-POST architecture enables parallel testing of multiple memories to reduce test time and is used for power-on testing of the memories on-chip.

C2000 devices are powerful 32-bit floating-point microcontroller units (MCU) designed for advanced closed-loop control applications such as motor control and power conversion control in industrial drives and automation, industrial power, solar, and electrical vehicle applications. In addition to the strong control performance offered by the MCU, it supports a host of functional safety features to support customers to design and certify their functionally safe systems. Memory Power-On Self-Test (M-POST) is an important enabler to test the device SRAMs and ROMs during device start-up. Based on customer one-time programmable (OTP) configurations, the test is executed automatically with the help of on-chip hardware during boot-up. When the test is executed, multiple memories are tested in parallel to reduce the impact on boot-time.

The IEEE Standard 1149.1-1990, IEEE Standard Test Access Port and Boundary-Scan Architecture (JTAG) is a method for verifying designs and testing printed circuit boards after assembly. It is used as the primary means for transferring data to a nonvolatile memory of an embedded system and debugging embedded software.

This application report describes the physical connections for JTAG and design considerations to be taken into account for a custom board. It also shows how to use the JTAG interface on the SimpleLink™ MSP432E4 LaunchPad™ development kit for debugging the onboard microcontroller using an external debugger, or by using the onboard debugger for debugging an off-board microcontroller.

In the past several years, multiple digital and wireless ultrasound probes have been introduced to physicians as vision-enhanced stethoscopes, which may someday replace the traditional 150-year-old stethoscope. GE’s Vscan, Siemens’ Freestyle, SonoSite's iViz and Philips’ Lumilify are among the first wave of ultra-portable probes for physicians and rural villages. Ultrasound imaging may be the only modern imaging modality choice for rural areas because of its cost-effectiveness and portability. It is exciting to TIers to innovate and deliver solutions to serve people who may have never been served by modern medicine.

Further reducing power requirements and increasing image quality demands high channel count and low power ICs. The AFE5832LP and AFE5832 devices are designed to address these needs. The AFE5832 is industry’s first 32-CH analog front-end (AFE) solution, and the AFE5832LP is its lower power version. Both devices are pin-to-pin compatible. The AFE5832LP achieves power consumption of < 20 mW/CH, which is approximately 6× lower than the power consumption of the AFE5818 and AFE5808 devices in traditional console systems.

Core Independent Peripherals (CIPs) are specially designed hardware blocks inside a microcontroller (MCU) that add new capabilities, reduce code and improve system performance. This application note will showcase an example of this by discussing the design elements, decisions and logic that went into building a Peltier Cooled Metal Plate with only one microcontroller: a 20-pin PIC16F17146.

This document discusses the migration of an existing MPLAB Harmony v3 based project developed on a particular hardware (microcontroller or development board) platform to another one of Microchip's 32-bit hardware platforms of the user's choice.

The automotive industry is undergoing unprecedented change, with the move to electrification and ongoing development in safety devices and autonomous vehicles resulting in an increased demand for semiconductors. DC motors are experiencing exponential growth in areas ranging from simple, low-power brushed versions to high-power brushless DC motors (BLDC). According to Allied Market Research, the Brushless DC motors industry will reach $72.24 Bn by 2030, compared to $33.15 Bn in 2020. This in turn increases the requirement for a variety of motor driver solutions.

Diodes Incorporated (Diodes) has developed two demo boards featuring its automotive ‘Q’ MOSFET and portfolio of gate driver ICs to target BLDC Motor applications in the automotive sector.

Single Channel Smart load switch provides a component and area-reducing solution for efficient power domain switching. In addition to integrated control functionality with ultra-low on−resistance (<15 mΩ), this device offers system safeguards and monitoring via the fault protection (Short circuit protection, SCP) and power good signal. This cost effective solution is ideal for power management and hot-swap applications requiring low power consumption in a small footprint.

The Internet of Things (IoT) can be broadly defined as an umbrella term for a range of technologies that enable devices to connect and interact with each other. Interacting devices generating data provide the foundation for a range of new applications. Industrial automation, healthcare, smart home, smart cities, smart grids and smart farming are some of the areas in which IoT provides substantial benefits.

Dubbed the "fourth industrial revolution" or Industry 4.0, the Industrial IoT (IIoT) is the digitization of industrial assets and processes that connects products, machines, services, locations/ sites to workers, managers, suppliers, and partners. Closer networking of the digital world with the physical world of  machines helps achieve higher productivity, safety, efficiency and sustainability.

The core task of any IoT solution is to get data from the field to the cloud where analysis of the same generates the desired value addition for the application. This application note aims to propose an elegant solution to achieve this task based on Adrastea-I Cellular module.

Gigabit Ethernet has established itself as the standard in the networking in office and industrial environments. However, when designing a Gigabit Ethernet interface, questions often arise about the shield connection of the cable and the design of the front end, especially with regard to the ground connections. Searches on the Internet reveal various suggestions for shield termination, often suggesting a 1-nF Y capacitor. However, the effect on the performance of the interface and the EMC behavior is not described. Würth Elektronik has therefore developed a reference design to be able to measure EMC aspects in detail. This App Note is based on the reference design and takes a detailed look at the EMC behavior of the Gigabit Ethernet interface with different shield connections and configurations.  In addition, the App Note provides design recommendations based on extensive hardware testing.

Contents:

• Gigabit Ethernet basics
• Measurements in the time domain
• EMC evaluation of the reference design
  Disturbance variables
  Interference emission
  Interference immunity
• Conclusion and design recommendations

MEMS sensors have primarily digital interfaces. The I²C bus is one of these interfaces, which also support a bus system. Different sensors, which typically have a different I²C address, can thus be easily addressed individually via this bus. However, it becomes challenging when several sensors with identical I²C addresses are to be operated on one bus. This document shows different solutions how to build up a bus system nevertheless.

Electric motors request high starting current. Capacitors could have high discharge current. Certain type of lightening and many more examples request high current during a short time. Would you need to design your connector on this inrush current that is use for a short period of time or save money and space with a connector that simply respect stable current ?

You will learn how to use inrush currents that exceed working ones, up to 16 times on terminal blocks.

SiC MOSFET module application note Electrical characteristics

This document describes the basic structures, ratings, and electrical characteristics of IGBTs. It also provides usage considerations for IGBTs.

This document summarizes some tips for designing peripheral circuits that should be noted when you use the VCE(sat) detection function of a smart gate driver coupler such as TLP5214A/TLP5214/TLP5212/TLP5222. The VCE(sat) detection (DESAT detection) circuit which detects the rise of the collector or drain voltage (VCE) when an over-current flows into the power semiconductor switch device (hereinafter referred to ‘power device’) driven by the gate driver by causes, such as a short circuit of load, makes the power device turn off, and protects it. However, the VCE may rise unusually and largely due to the inductances of the loads when the power device switches, and if it enters the DESAT terminal, an erroneous detection of the DESAT detection circuit may occur. In three-phase inverters and other inverters, noise generated during switching of other phases may cause an erroneous detection of the DESAT detection circuit due to noise circulating through power supply lines and GND lines or electromagnetic induction between wires. This document provides tips to reduce the likelihood of DESAT false detections.