PolarFire FPGAs represent the industry's most advanced security programmable FPGAs. Data security protects application data—stored, communicated, or computed at run-time—from being copied, altered, or corrupted.

This document describes how to run the imaging and video demo using the PolarFire video kit, with a single camera sensor from the dual-sensor module and a DisplayPort Tx. The demo design features a fully integrated solution developed using Microchip’s Libero® System-on-Chip (SoC) software to help customers evaluate PolarFire FPGA in smart embedded vision applications and to build prototypes quickly.

Core Independent Peripherals (CIPs) are specially designed hardware blocks inside a microcontroller (MCU) that add new capabilities, reduce code and improve system performance. This application note will showcase an example of this by discussing the design elements, decisions and logic that went into building a Peltier Cooled Metal Plate with only one microcontroller: a 20-pin PIC16F17146.

This document discusses the migration of an existing MPLAB Harmony v3 based project developed on a particular hardware (microcontroller or development board) platform to another one of Microchip's 32-bit hardware platforms of the user's choice.

This application note describes the implementation of a Radiation Tolerant Port Expander application using the Serial Peripheral Interface (SPI) interface on the ATmegaS family of space-qualified AVR Microcontrollers (MCUs). The goal is to functionally emulate the MCP23S17. The ATmegaS128 is a function and pin-identical variant of the ATmega128 commercial device, and it ensures a full code and toolchain compatibility.

This document provides Microchip's 32 MCU Wafer-Level Chip-Scale Packages (WLCSP) information. It gives details such as bootloader, programming, and ordering guidelines. It also includes information on handling, shipping, SMT, and rework.

The D3PAK surface-mount power package accommodates silicon chips with dimensions up to 416 × 270 mils. Such chips, when housed in the TO-247 package, can dissipate up to 360W at a case temperature of 25°C. However, these same chips are limited to less than 7W at 25°C ambient, when housed in a D3PAK and soldered to a standard FR-4 printed circuit board (PCB). Clearly, any technique capable of boosting the D3PAK dissipation capability nearer to the TO-247 benchmark merits close attention.

This application note will compare the thermal performance of various mounting methods for the D3PAK including classic surface mount device (SMD) printed circuit board mounting; insulated metal substrate (IMS) mount down, with and without an attached heat sink; oven-fired ceramic substrate, with and without heat sink; and direct bonded copper (DBC) substrates, with and without heat sink.

The importance of optimized bonding will be explored, independent of the actual substrate used, covering choice of appropriate solder alloys and fluxes, as well as the layout of the interface metallization patterns to preclude voiding during reflow operations.

Finally, a relative cost versus performance evaluation will be presented on the various methods described in the paper.

The purpose of this application note is to help FPGA designers to implement the Triple Module Redundancy (TMR) design technique on a VHDL design, which is targeted on a Microchip Radiation-Tolerant PolarFire (RT PolarFire) FPGA.

This application note describes how to implement each logical register with a TMR register on different hierarchies of a VHDL/Verilog design. It shows how to use the syn_radhardlevel synthesis attribute on the architecture and signal on different hierarchies.

These design example projects are targeted towards use in a RTPF500T-CG1509M device (Rad-Tolerant PolarFire FPGA, 500K Logic-Elements with High-Speed Serial Transceivers in a Ceramic Column Grid Array Package with 1509 solder columns).

Radiation-Tolerant (RT) PolarFire FPGAs are derived from PolarFire 28 nm non-volatile and reprogrammable FPGA devices from Microchip.

This document summarizes the differences between the RTPF500T and RTPF500ZT device versions.

This application note describes the Sigma-Delta Analog-to-Digital Converter (SDADC) in ATSAMC21N device is configured in differential mode and the SDADC results are displayed on a console. It also provides example code for both interrupt and polling methods, developed using MPLAB® X IDE and MPLAB Harmony v3 Configurator

This configuration guide provides information on how to make Port-to-port and 1PPS calibrations to improve timing by adjusting the ingress/egress latencies.

This document describes how to run the LiteFast IP demo on the PolarFire® Evaluation Board using the LiteFast GUI application.

The File Transfer Protocol (FTP) is a standard internet protocol provided by TCP/IP for transmitting files from one device to another. It is an application layer protocol within the TCP/IP stack layers. An embedded FTP client/server is an excellent addition to any network-enabled device. The FTP client module will enable your application to upload and download files from any FTP server. This protocol enables data transfer reliably and efficiently between different devices without worrying about the file storage systems of a Host.

This document focuses on the FTP implementation of the MPLAB Harmony v3 TCP/IP stack. It also provides a combined FTP client and FTP server demonstration using the SAM E54 microcontroller. The FTP client application has an Ethernet bootloader that downloads the application binary from the FTP server and updates the firmware by self-programming.

This application note describes how to build a Mi-V processor subsystem to execute a user application from the designated fabric RAMs or DDR memory.

This application note describes how to initialise the Static Random Access Memory (SRAM) blocks of Microchip RTG4 Field Programmable Gate Array (FPGA) with user data after power-up. The design for this application note uses a Large SRAM (LSRAM) block, which is initialised by an FPGA fabric master through the Advanced Microcontroller Bus Architecture Advanced Peripheral Bus interface (AMBA APB bus).

RTG4 FPGA devices have embedded SRAM blocks (LSRAM and µSRAM) in the fabric. Both LSRAM and µSRAM blocks are placed in multiple rows within the FPGA fabric, and they can be accessed through the fabric routing architecture.

This document focuses on the FTP implementation of the MPLAB® Harmony v3 TCP/IP stack, available in the latest MPLAB Harmony v3 framework. It also provides an FTP client demonstration using the SAM E70 microcontroller. This demonstration implements an Ethernet bootloader using FTP, through which the SAM E70 client downloads a binary for self-programming from an FTP server.

This document describes how to use the Direct Memory Access Controller (XDMAC) with the Quad Serial Peripheral Interface (QSPI) on a Arm®Cortex®-M7 based MCU (SAM E70). It also describes the implementation of an application using the MPLAB® Harmony v3 Software Framework, and evaluates performance of QSPI read and write operations with or without XDMAC.

The bootloader is a piece of code used to program or re-program the application code (firmware) to the internal Flash of the microcontroller without the need for an external programmer or debugger.

This document describes the dual-bank bootloader provided by MPLAB Harmony v3. The dual-bank bootloader utilizes the dual-bank feature of the internal Flash for safer application upgrade.

The CoreEDAC IP generates Error Detection And Correction (EDAC) circuitry for both internal (on-chip) and external RAM blocks. The user data is fed to the EDAC encoder, which calculates the parity bits and appends these to the user data, forming a codeword. The codeword is stored into the RAM. During user read, the read codeword is decoded first, which detects and corrects errors (if any), discards parity bits, and outputs the corrected user data word. Scrubbing periodically checks every memory location using the ECC decoder. If a location contains a corrupted word, the decoder detects and corrects the word. The scrubbing circuitry then writes the corrected word back to the same location. To provide normal access to the RAM and prevent decreasing performance, scrubbing is only done during idle periods. The scrubbing circuitry sets a proper write address and write enable signals, writing the corrected codeword back to the RAM. Writeback occurs only upon detecting an error.

This document is intended to guide MPLAB Harmony v2 users on how to develop applications using MPLAB Harmony V3.