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Evaluation Kits

SimpleLink™ Ethernet MSP432E401Y MCU LaunchPad™ Development Kit

Texas Instruments
The SimpleLink™ Ethernet MSP432E401Y microcontroller LaunchPad™ Development Kit is an intuitive evaluation platform for SimpleLink™ Arm® Cortex®-M4F-based Ethernet MCUs. The Ethernet LaunchPad development kit highlights the MSP432E401Y MCU with integrated Ethernet MAC and PHY and a wide variety of wired communication interfaces including USB-OTG, CAN, Quad-SPI (QSSI), I2C, SPI,  UART and other serial protocols. Featuring a 120MHz Arm Cortex-M4F CPU, 1MB of flash, 256kB of SRAM, and advanced cryptographic accelerators, MSP432E4 MCUs offer an ample amount of processing resources for developers to implement wired and wireless connectivity stacks and processing algorithms to develop robust Ethernet solutions. Developers can leverage a number of SimpleLink wireless MCU BoosterPack™ plug-in modules and SimpleLink software SDK plug-ins to seamlessly add wireless connectivity and cloud integration to the application to build IoT-ready, interoperable, and intelligent industrial gateway applications. Features: SimpleLink Ethernet MSP432E401Y 32-bit Arm Cortex-M4F MCU 80 pin LaunchPad standard leveraging the BoosterPack ecosystem On-board XDS-110 debug probe Ethernet and USB-OTG 2 user buttons and 4 LEDs for user interaction What's included: 1x MSP-EXP432E401Y LaunchPad Development Kit 1x Micro USB Cable 1x Quick Start Guide SIMPLELINK-MSP432-SDK, SimpleLink MSP432 Software Development Kit (SDK)

MSP430FR2355 LaunchPad Development Kit

Texas Instruments
The MSP-EXP430FR2355 LaunchPad Development Kit is an easy-to-use evaluation module (EVM) based on the MSP430FR2355 Value Line microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power MSP430FR2x Value Line MCU platform, including on-board debug probe for programming, debugging and energy measurements. The board includes 2 buttons and 2 LEDs for creating a simple user interface. It also has an ambient light sensor and connector for external analog sources. The MSP430FR2355 MCU includes a smart analog combo of configurable signal chain elements including options for multiple 12-bit digital-to-analog converters (DACs) and programmable gain amplifiers (PGAs) along with a 12-bit analog-to-digital converter (ADC) and two enhanced comparators (eCOMPs). One of the out-of-box demos includes a GUI to showcase some of the smart analog combo configurations. The 24MHz MSP430FR2355 device features 32KB of embedded FRAM (Ferroelectric Random Access Memory), a non-volatile memory known for its ultra-low power, high endurance, and high-speed write access. Combined with the 4KB of on-chip SRAM, users have access to 32KB of memory to split between their program and data as required. For example, a data logging application may require a large data memory with a relatively small program memory, so the memory may be allocated as required between program and data memory. Features: ULP FRAM technology based on the MSP430FR2355 16-bit MCU with smart analog combo On-board eZ-FET debug probe with EnergyTrace Technology available for ultra-low-power debugging 40-pin LaunchPad headers to leverage the BoosterPack ecosystem 2 buttons and 2 LEDs for user interaction On-board ambient light sensor On-board Grove module interface to add external sensors, actuators and more What's included: 1x MSP-EXP430FR2355 LaunchPad 1x USB Micro Cable

C2000 Delfino MCUs F28379D LaunchPad Development Kit

Texas Instruments
LAUNCHXL-F28379D is a low cost evaluation and development tool for the Delfino F2837xD and F2837xS series in the TI MCU LaunchPad ecosystem which is compatible with various plug-on BoosterPacks. This extended version of the LaunchPad supports the connection of two BoosterPacks. The LaunchPad provides a standardized and easy to use platform to use while developing your next application. Hardware Features: USB connected isolated XDS100v2 JTAG debug probe for real-time debug and flash programming 4x 20-pin headers/connectors Programmable buttons and LEDs TMS320F28379D: 200 MHz dual C28xCPUs and dual CLAs, 1 MB Flash, 16-bit/12-bit ADCs, comparators, 12-bit DACs, delta-sigma sinc filters, HRPWMs, eCAPs, eQEPs, CANs, and more C2000 Delfino Position Manager-ready TMS320F28379D MCU capable of interfacing to absolute encoders as well as resolvers and SINCOS transducers Supports two BoosterPacks Two encoder interface connectors Isolated CAN transceiver connector Software Features: Free download of Code Composer Studio IDE Free download of C2000Ware for device drivers and example projects DesignDRIVE platform support powerSUITE software support MathWorks Embedded Target Support solidThinking Embed Support What's Included: Delfino F28379D LaunchPad Mini USB Cable Quick Start Guide

TPD3S014-Q1 Current-Limit Switch and D+/D- ESD Protection for Automotive USB Evaluation Module

Texas Instruments
TPD3S014-Q1 Current-Limit Switch and D+/D- ESD Protection for Automotive USB Evaluation Module

DEM-OPA-SO-2A

Texas Instruments
BOARD DEMO FOR 8SOIC DUAL OPAMPS

Evaluation Module for TPS62160 a 1-A, synchronous, step-down converter in a 2x2-mm, 8-pin WSON

Texas Instruments
Evaluation Module for TPS62160 a 1-A, synchronous, step-down converter in a 2x2-mm, 8-pin WSON

TMP117 Digital Temperature Sensor Evaluation Board

Texas Instruments
Improving on the TMP116 family of high-accuracy temperature sensors, the TMP117 provides up to ±0.1°C accuracy over the entire range of human body temperature (30°C to 42°C) and ±0.2°C accuracy over its whole operating range of -55°C to 150°C, making it the world’s leading ultra-high-precision temperature sensor. Designed as a pin-to-pin compatible replacement for the TMP116, the TMP117 provides 16-bits of temperature data with each reading, translating to a temperature resolution of 7.8125 m°C. The ultra-high accuracy of the TMP117 around human body temperatures makes it suitable for ASTME1112 and ISO-80601 compliant medical applications. The Texas Instruments TMP117EVM (Evaluation Module) provides the user a simple way to get started with the TMP117. The evaluation module and GUI are designed to provide the user with a quick setup to evaluate the TMP117 and gain familiarity with the device down to the bit-by-bit register level. The EVM also features a perforated break-out portion, which allows the user to separate the TMP117 and still utilize the MSP430 and GUI to interact with and configure the device. Features: Provides GUI for simple and fast setup  Perforated PCB allows sensor to be placed in user’s system Provides best temperature accuracy measurement with 0.0078125°C resolution (16-bit) Example of PCB layout for fast thermal response time GUI runs online or through a desktop installation Supports many platforms (web, windows, linux, osx) What's included: USB Cable

DRV8353RS Three-Phase Smart Gate Driver Evaluation Module

Texas Instruments
The DRV8353RS-EVM is a 15A, 3-phase brushless DC drive stage based on the DRV8353RS gate driver and CSD19532Q5B NexFET MOSFETs. The module has individual DC bus and phase voltage sense as well as individual low-side current shunt amplifiers, making this evaluation module ideal for sensorless BLDC algorithms.  The module supplies MCU 3.3V power with an integrated 0.35A step down buck regulator.  The drive stage has IDRIVE configuration, along with a fault pin and protection for short circuit, thermal, shoot-through, and under voltage conditions through configurable SPI. Features: 9- to 95-V operation 15 A continuous / 20 A peak H-bridge output current Internal buck regulator Three individual, internal low-side current shunt amplifiers INSTASPIN FOC BLDC firmware available

Low IQ Boost Converter with Bypass Mode Evaluation Module

Texas Instruments
Low IQ Boost Converter with Bypass Mode Evaluation Module

MSP-TS430PZ5X100

Texas Instruments
TARGET BOARD ZIF SKT MSP430F5XX

Displaying 81 - 100 of 11411

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