Evaluation Kits

Manufacturer

Displaying 81 - 100 of 5490

Evaluation Kits

BQ25892 Complete Charger Evaluation Module

Texas Instruments

BQ25892 Complete Charger Evaluation Module

Evaluation Kit Parts

TPS65320C-EVM

Texas Instruments

EVALUATION MODULE

Evaluation Kit Parts

TPS61197EVM

Texas Instruments

EVAL MODULE FOR TPS61197

Evaluation Kit Parts

DS280DF810 28 Gbps Multi-Rate 8-Channel Retimer Evaluation Module

Texas Instruments

DS280DF810 28 Gbps Multi-Rate 8-Channel Retimer Evaluation Module

Evaluation Kit Parts

The TPSM846C23DEVM-807 evaluation module (EVM) is configured to evaluate the parallel operation of the TPSM846C23 PMBus power module for output currents up to 70 A. The input voltage range is 4.5 V to 15 V, with an output voltage range of 0.35 V to 2.0 V. The EVM’s PMBus interface allows power supply configuration as well as monitoring of key parameters, including output voltage, output current, and the internal die temperature, as well as many user programmable configuration options. The EVM has several test points and jumpers to easily evaluate the TPSM846C23 parallel operation. The EVM includes a PMBus connector to interface with a host PC. The USB-to-GPIO interface adapter pod is required to program the EVM. The USB-to-GPIO interface pod connects the EVM to a computer USB port which allows the TI “Fusion” Graphical User Interface (GUI) to communicate and control the EVM. The TPSM846C23DEVM-807 can be ordered separately or as part of a bundle with the USB-to-GPIO interface adapter pod. Features: 4.5V to 15V Input Voltage Range Two TPSM846C23 devices in parallel PMBus configurable Up to 70A of Output Current

Evaluation Kit Parts

MSP-TS430QFN23X0

Texas Instruments

TARGET BOARD ZIF SKT MSP430

Evaluation Kit Parts

BQ40Z80 2s-7s Battery Gauge Evaluation Module

Texas Instruments

The bq40z80 EVM includes one bq40z80, two bq771807 secondary protectors, and a link to Microsoft Windows based PC software, which can be used to monitor and predict capacity, perform cell balancing, monitor critical parameters, protect the cells from overcharge, over-discharge, short circuit, and overcurrent in 2-, 3-, 4-, 5-, 6-, or 7-series cell Li-ion or Li-polymer battery packs. The circuit includes an on-board EV2400 interface to USB so the software can read bqz40z80 data registers, program the chipset for different pack configurations, log cycling data for further evaluation, and evaluate the overall functionality of the solution under different charge and discharge conditions. Features: 2s-7s battery gauging with protection Supports internal and external cell balancing Multiple GPIOs and LED support Protection features include: Oover and under voltage Short circuit in charge and discharge Charge and pre-charge timeout Over and under temperaure What's included: BQ40Z80EVM-020 evaluation module USB cable

Evaluation Kit Parts

THS4275 Evaluation Module

Texas Instruments

THS4275 Evaluation Module

Evaluation Kit Parts

BQ24450EVM-691

Texas Instruments

EVAL MODULE FOR BQ24450

Evaluation Kit Parts

TAS5727EVM Evaluation Module

Texas Instruments

TAS5727EVM Evaluation Module

Evaluation Kit Parts

TPS2554EVM-010

Texas Instruments

EVAL MODULE FOR TPS2554-010

Evaluation Kit Parts

PGA460-Q1 Ultrasonic Sensor Signal Conditioning EVM With Transducers

Texas Instruments

The PGA460-Q1 evaluation module (EVM) is a collective of the BOOSTXL-PGA460 and MSP-EXP430F5529LP, which enables users to fully evaluate the PGA460-Q1 ultrasonic sensor signal conditioner with an open-air transducer. Transducer compatibility is expanded to open- or closed-top transducers operating between 30-80kHz and 180-480kHz. Driver strength can be controlled by current limiting the transformer or direct driver mode to generate the maximum sound pressure level during echo transmission. The receiver can be tuned to filter and process returned echo data for post-measurement analysis. The associated PGA460-Q1 EVM GUI can be used to customize, configure, and control the ultrasonic setup, and monitor the performance of the resulting ultrasonic activity. The BOOSTXL-PGA460 includes one transformer driven closed-top transducer, and one direct driven open-top transducer for comparison. Features: Compatible with ultrasonic transducers operating at a center frequency between 30-80kHz and 180-480kHz. Able to generate maximum sound pressure level using either transformer driven and direct driven methods. Access to all communication interfaces offered by the PGA460-Q1, including: USART, TCI, and One-Wire UART. Swappable daughtercard allows custom driver-type and transducer combination pair to be evaulated. Fully tested EVM includes GUI, quick start demo procedure, USB interface and firmware, and detailed user's guide. What's included: BOOSTXL-PGA460 PGA460-Q1 EVM Quick Start Guide

Evaluation Kit Parts

CC2533DK-RF4CE-BA

Texas Instruments

KIT DEV RF4CE FOR CC2533

Evaluation Kit Parts

TPS74001DGKEVM-722

Texas Instruments

EVAL MODULE FOR TPS74001DGK-722

Evaluation Kit Parts

SMARTRFTRXEBK

Texas Instruments

EVAL BOARD SMART RF

Evaluation Kit Parts

ADS1015EVM-PDK

Texas Instruments

KIT DEMO FOR ADS1015

Evaluation Kit Parts

LMK61I2-100M00 Ultra-Low-Jitter Fixed Frequency Oscillator EVM

Texas Instruments

LMK61I2-100M00 Ultra-Low-Jitter Fixed Frequency Oscillator EVM

Evaluation Kit Parts

SimpleLink™ Wi-Fi® CC3235S dual band LaunchPad™ development kit

Texas Instruments

The SimpleLink™ Wi-Fi® CC3235S dual band LaunchPad™ development kit (LAUNCHXL-CC3235S) highlights CC3235S, a single-chip security solution and wireless microcontroller (MCU) which integrates a user application dedicated ARM® cortex®-M4 MCU and a network processor that runs 2.4GHz and 5GHz Wi-Fi, internet, and security protocols. The LAUNCHXL-CC3235S features on-board emulation and sensors for a full out-of-the-box experience and rapid development. This board can be directly connected to a PC for use with development tools such as the Code Composer Studio™ Cloud integrated development environment (IDE). Visit dev.ti.com and get started with your SimpleLink Wi-Fi CC3235S LaunchPad kit today.Expedite your application development for fast time to market with our launchpad’s driver support and a software development kit (SDK) with 30+ applications for Wi-Fi protocols, Internet applications and MCU peripheral examples. Features: CC3235S dual band Wi-Fi microcontroller (MCU) in QFN package 2x20 pin stackable connectors (BoosterPack headers) to connect to TI LaunchPads and other BoosterPacks On-Board chip antenna with option for U.FL based testing A single Chip Security Solution Support for BLE coexistence Operates from alkaline batteries for lower power designs What's included: Quick Start Guide USB Cable

Evaluation Kit Parts