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Evaluation Kits from Texas Instruments

MSP430FR2355 LaunchPad Development Kit

Texas Instruments
The MSP-EXP430FR2355 LaunchPad Development Kit is an easy-to-use evaluation module (EVM) based on the MSP430FR2355 Value Line microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power MSP430FR2x Value Line MCU platform, including on-board debug probe for programming, debugging and energy measurements. The board includes 2 buttons and 2 LEDs for creating a simple user interface. It also has an ambient light sensor and connector for external analog sources. The MSP430FR2355 MCU includes a smart analog combo of configurable signal chain elements including options for multiple 12-bit digital-to-analog converters (DACs) and programmable gain amplifiers (PGAs) along with a 12-bit analog-to-digital converter (ADC) and two enhanced comparators (eCOMPs). One of the out-of-box demos includes a GUI to showcase some of the smart analog combo configurations. The 24MHz MSP430FR2355 device features 32KB of embedded FRAM (Ferroelectric Random Access Memory), a non-volatile memory known for its ultra-low power, high endurance, and high-speed write access. Combined with the 4KB of on-chip SRAM, users have access to 32KB of memory to split between their program and data as required. For example, a data logging application may require a large data memory with a relatively small program memory, so the memory may be allocated as required between program and data memory. Features: ULP FRAM technology based on the MSP430FR2355 16-bit MCU with smart analog combo On-board eZ-FET debug probe with EnergyTrace Technology available for ultra-low-power debugging 40-pin LaunchPad headers to leverage the BoosterPack ecosystem 2 buttons and 2 LEDs for user interaction On-board ambient light sensor On-board Grove module interface to add external sensors, actuators and more What's included: 1x MSP-EXP430FR2355 LaunchPad 1x USB Micro Cable

TAS2505EVM

Texas Instruments
EVALUATION MODULE TAS2505

DRV201A Evaluation Module for 100mA Voice Coil Motor Driver with Advanced Ringing Compensation

Texas Instruments
DRV201A Evaluation Module for 100mA Voice Coil Motor Driver with Advanced Ringing Compensation

PGA460-Q1 Ultrasonic Sensor Signal Conditioning EVM With Transducers

Texas Instruments
The PGA460-Q1 evaluation module (EVM) is a collective of the BOOSTXL-PGA460 and MSP-EXP430F5529LP, which enables users to fully evaluate the PGA460-Q1 ultrasonic sensor signal conditioner with an open-air transducer. Transducer compatibility is expanded to open- or closed-top transducers operating between 30-80kHz and 180-480kHz. Driver strength can be controlled by current limiting  the transformer or direct driver mode to generate the maximum sound pressure level during echo transmission. The receiver can be tuned to filter and process returned echo data for post-measurement analysis. The associated PGA460-Q1 EVM GUI can be used to customize, configure, and control the ultrasonic setup, and monitor the performance of the resulting ultrasonic activity.  The BOOSTXL-PGA460 includes one transformer driven closed-top transducer, and one direct driven open-top transducer for comparison. Features: Compatible with ultrasonic transducers operating at a center frequency between 30-80kHz and 180-480kHz. Able to generate maximum sound pressure level using either transformer driven and direct driven methods. Access to all communication interfaces offered by the PGA460-Q1, including: USART, TCI, and One-Wire UART. Swappable daughtercard allows custom driver-type and transducer combination pair to be evaulated. Fully tested EVM includes GUI, quick start demo procedure, USB interface and firmware, and detailed user's guide. What's included: BOOSTXL-PGA460 PGA460-Q1 EVM Quick Start Guide

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