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Evaluation Kits

TPA3251D2 PurePath Ultra-HD Evaluation Module

Texas Instruments
The TPA3251D2EVM PurePath™ Ultra-HD evaluation module demonstrates the TPA3251D2DDV integrated circuit from Texas Instruments. The TPA3251D2DDV is a high-performance class-D amplifier that enables true premium sound quality with high efficiency class-D technology. It features an advance integrated feedback design and high-speed gate driver error correction (PurePath™ Ultra-HD), which enables ultra-low distortion across the audio band and superior audio quality.   This EVM supports 2 BTL (stereo 2.0) output channels,  1 PBTL (mono 0.1) output channel, 1 BTL plus 2 SE (2.1) output channels,  and 4 SE (4.0) output channels configurations. The NE5532 is a High Performance Audio Op Amp designed to allow TPA3251D2DDV operation with differential or single ended input signals to the EVM with differential inputs yielding the optimal performance. TPA3251D2EVM is a complete 2Vrms analog input 2 × 175 W stereo/1 x 350 W mono power amplifier ready for evaluation and excellent listening experience. Features: Stereo PurePath™ Ultra-HD evaluation module Self-contained protection system (short circuit, clip and thermal) Standard 2VRMS differential input  or single ended line input BTL, PBTL and SE output configurations support Double-sided, plated-through, 2oz. Cu 2 layer PCB layout

HD3SS213-1-2MUXEVM: 5.4Gbps DisplayPort 1.2a 2:1/1:2 Differential Switch Evaluation Module

Texas Instruments
HD3SS213-1-2MUXEVM: 5.4Gbps DisplayPort 1.2a 2:1/1:2 Differential Switch Evaluation Module

MSP430FR5994 LaunchPad Development Kit

Texas Instruments
The MSP-EXP430FR5994 LaunchPad™ Development Kit is an easy-to-use evaluation module (EVM) for the MSP430FR5994 microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power MSP430FR5x FRAM microcontroller platform, including on-board debug probe for programming, debugging and energy measurements. The board includes buttons and LEDs for quick integration of a simple user interface as well as two unique features: a microSD card slot allowing the user to interface with SD cards, as well as a super capacitor (super cap) that acts like a rechargeable battering, enabling standalone applications without an external power supply. The 16MHz MSP430FR5994 device features 256KB of embedded FRAM (Ferroelectric Random Access Memory), a non-volatile memory known for its ultra-low power, high endurance, and high speed write access. Combined with the 8 KB of on-chip SRAM, users have access to 264KB of memory to split between their data and code as they see fit. For example, a data logging application can greatly benefit from the fast, low-power writes into FRAM – and all of that without fear data-loss due to loss-of-power. The MSP430FR5994 includes the new Low-Energy Accelerator (LEA). This new hardware module delivers fast, efficient, low-power vector math acceleration commonly found in digital signal processing (DSP) applications. This makes it easy for the MSP430 to process incoming analog data in real-time. With benchmarks that outpace 32-bit ARM® Cortex®-M0+ MCUs by more than 40x, this nimble MCU delivers performance with exceedingly low power consumption. The device also includes a wide variety of integrated peripherals including: communication ports, timers, real-time clock, AES encryption and CRC error-checking accelerators, as well as the included analog comparator and a multichannel ADC with its ultra-low power, window-based interrupts. TI's ULP Advisor provides hints to improving software efficiency while the compiler does its job. Taking this much further, the EnergyTrace++ features let the debugger offer up unprecedented visibility into code execution - in two different ways. First, the LaunchPad kit's debugger hardware keeps track of each micro Joule in time, letting CCS provide detailed graphs of energy usage. Second, the MSP430FR5x/6x MCU gives users a unique look inside the chip - logging the CPU's power states as well as the status of each integrated peripheral. Along with the LaunchPads EnergyTrace++ enabled debugger, rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPacks modules. Using these, it’s easy to quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. To get started, plug the Audio and Sharp LCD BoosterPack modules onto your MSP-EXP430FR5994 LaunchPad kit to run the Filtering and Signal Processing TI Design, which is a good way to evaluate the MSP430FR5994 CPU with the LEA module. Alternatively, with only the LaunchPad in hand, check out how to solve your EEPROM requirements using the TIDM-FRAM-EEPROM TI Design. Free software development tools are available, such as MSP430Ware, TI’s Eclipse-based Code Composer Studio™ (CCS) and IAR Embedded Workbench. As well, both of these IDEs support EnergyTrace++ technology for real-time power profiling and debugging when paired with the MSP430FR5994 LaunchPad kit. Features: ULP FRAM technology based MSP430FR5994 16-bit MCU with low-energy accelerator (LEA EnergyTrace++ Technology available for ultra-low-power debugging 40-pin LaunchPad kit standard leveraging the BoosterPack ecosystem On-board eZ-FET debug probe 2 buttons and 2 LEDs for user interaction On-board micro SD Card Super Capacitor (0.22 F) What's included: 1 x MSP-EXP430FR5994 LaunchPad Development Kit 1 x Micro USB Cable 1 x Quick Start Guide  

DRV10983 Three-Phase Brushless Motor Driver Evaluation Module

Texas Instruments
The DRV10983EVM (evaluation module) serves as a user-friendly evaluation kit to demonstrate TI’s brushless motor driver DRV10983. A GUI  software and user guide are provided to help customers tune and configure Sensorless BLDC motors for proper operation. This EVM is a high-performance, power-efficient, cost-effective platform that speeds development for quicker time to market. Features: 8-28V supply voltage range 2.0A continuous / 3A peak output current PWM, I2C or onboard analog potentiometer speed control  USB2ANY board included for I2C GUI communication

Evaluation Module for TPS7A8001 Low-Noise, High-Bandwidth PSRR, 1A Low-Dropout Linear Regulator

Texas Instruments
Evaluation Module for TPS7A8001 Low-Noise, High-Bandwidth PSRR, 1A Low-Dropout Linear Regulator

Sub-1 GHz and 2.4 GHz Antenna Kit for LaunchPad and SensorTag

Texas Instruments
This new antenna kit allows you to do real-life testing to find the optimal antenna for your application! The antenna kit includes 16 antennas for frequencies from 169MHz to 2.4GHz including PCB antennas, Helical antennas and Chip antennas as well as dual band band antennas for 868/915MHz combined with 2.4GHz. The antenna kit includes a uSMA(JSC) cable to connect the wireless LaunchPads and SensorTags. The following kits are compatible with the JSC connector: LAUNCHXL-CC2650 LAUNCHXL-CC1310 LAUNCHXL-CC1350 CC1350STK The kit also include a uSMA(JSC)-SMA connector for connecting the kit or antennas to a standard SMA connector. Features: 16 Antennas for 169MHz, 315MHz, 433MHz, 868MHz, 915MHz, 2.4GHz Compatible with LaunchPad and SensorTag Includes everything needed for real-life testing of antennas What's included: 1 x Antenna Kit 1 x uSMA - SMA cable 1 x uSMA - uSMA cable

BQ2057C Evaluation Module for Li-Ion, linear (4.2V), one cell

Texas Instruments
BQ2057C Evaluation Module for Li-Ion, linear (4.2V), one cell

UCD3138 Hard Switching Full Bridge Converter Evaluation Module

Texas Instruments
UCD3138 Hard Switching Full Bridge Converter Evaluation Module

Displaying 61 - 80 of 4838

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EVALUATION KITS

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