6A Termination Supply Tracks 1/2 Core Voltage
Texas Instruments6A Termination Supply Tracks 1/2 Core Voltage
DP83867E/IS/CS/IR/CR RGZ Power Consumption Data
Texas InstrumentsPower consumption on an Ethernet PHY is affected by different operating conditions. System design around Ethernet products requires accurate power consumption numbers for component selection thermal management and power distribution planning. This application report details power consumption of DP83867 in different conditions.
Interfacing the MSP430 and TLC549/1549 A/D Converters
Texas InstrumentsThis application report describes how to interface an MSP430 mixed-signal microcontroller with the TLC549 and TLV1549 3-volt A/D converters. This report is written for the MSP430x11x(1) family, but ca
TMS320C54x Application Code Examples
Texas InstrumentsThis application report contains complete code examples for routines that have been developed using a TMS320C54x? EVM platform. These programs demonstrate applications that use a host interface and run in real time.
Plastic Package Moisture-Induced Cracking (Rev. A)
Texas InstrumentsPlastic Package Moisture-Induced Cracking
TMS320C6474 Multicore Digital Signal Processor Technical Brief
Texas InstrumentsThe TMS320C6474 DSP integrates three 1-GHz C64x+ DSP CPU cores, a host of high-speed peripherals, and large amounts of internal memory in a compact 23 mm by 23 mm package. These features allow the C64
Designing Modular EVMs for Data Acquisition Products
Texas InstrumentsThis document defines a common set of design guidelines or modular evaluation modules from the Data Acquisition Products group. Adherence to these recommendations ensures the highest degree of compatibility across system Development platforms. This document will help users of the 5-6K interface board (SLAU104) and the HPA449 Demonstration Board (www.softbaugh.com) develop a customizable reconfigu
Using the TMS320C24x DSP Controller for Optimal Digital Control
Texas InstrumentsAlthough traditional microcontrollers include the necessary peripherals to provide solutions for digital control applications they lack both the performance and architecture needed to perform real-time math-intensive advanced control algorithms at a desired bandwidth.This application report describes the features of the Texas Instruments (TI)(tm) TMS320C24x digital signal processor (DSP) a
OMAP: Enabling Multimedia Applications in 3G Wireless Terminals
Texas InstrumentsThis paper describes how the Open Multimedia Applications Platform(tm) software and hardware architecture enables multimedia applications in third-generation (3G) wireless appliances. It provides an overview of OMAP(tm) strategy concepts main milestones and achievements. It also describes OMAP hardware architecture explains how multimedia applications can benefit from this advanced architectur
TPS65910x Power Sequencing Configurations
Texas InstrumentsThis document discusses the default voltages and boot orders of the TPS65910x power management integrated circuits (PMICs).
DRV10866 Lock Detection Functionality
Texas InstrumentsDRV0866 DRV10866 Lock Detection Functionality
Land Pattern Recommendations (Rev. A)
Texas InstrumentsThe following land pattern recommendations are provided as guidelines for board layout and assembly purposes.
These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP.
For SOT-23 (5-Lead) and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for MA05A and TS3B or TS5B packages, respectively.
Powering the AM1705 and AM1707 With the TPS650061 (Rev. A)
Texas InstrumentsThis document details the design considerations of a power solution for the AM1705 and AM1707 (AM1705/07) low-power application processor with a TPS650061 three-rail Power Management Unit (PMU) or Power Management Integrated Circuit (PMIC).Portable application solution size demands a high level of integration and the AM1705/07 requires at least three different voltage rails with specific seq
TMS320C6416 Power-On Self Test (Rev. A)
Texas InstrumentsThe Power-On Self Test (POST) is designed to verify the operation of the TMS320C6416. Six modules are included in this test: Chk6xTest MemoryEdmaTest VcpTest TcpTest McbspTest and TimerTest. These modules check the proper operation of the CPU core internal memory and several on-chip peripherals (EDMA McBSPs timers Viterbi and turbo decoder coprocessors).
It is important to note that thi
Stabilizing difference amplifiers for headphone applications
Texas InstrumentsThe recent increase in popularity of high-fidelity headphones and lossless audio formats has caused many manufacturers of personal electronics to add high-quality audio outputs to their devices. As a result, 24-bit/192-kHz audio digital-to-analog converters (DACs), once reserved for home highfidelity systems, are now being incorporated into mobile devices such as cell phones, tablets, and portable music players. These DACs deliver extremely low-distortion signals, but are unable to drive headphones directly. To take full advantage of these high-performance parts, a well-designed headphone amplifier must also be added to the system.
Autonomous high density streaming protocol
Texas InstrumentsThis application report describes a new high density streaming protocol that was developed for the new series of ultra-low cost 2.4 GHz System-on-Chip (SoC) devices called CC2543/4/5. With this protocol it is possible to setup a large number of point-to-point links in the same physical environment. Examples of applications where such a protocol could be used are patient monitoring systems remote
SN65LV1021/1212 SN65LV1023/1224 10:1 SERDES EVM
Texas InstrumentsSN65LV1021/1212 SN65LV1023/1224 10:1 SERDES EVM
