56-Pin Quad Flatpack No-Lead Logic Package
Texas InstrumentsTexas Instruments (TI) Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220 allows for board miniaturization and holds several advantages over traditional SOIC TQFP TSSOP and TVSOP packaging. This package designated RGQ by TI physically is smaller than traditional leaded solutions has a smaller routing area improved thermal performance and improved electric
AN-558 Introduction to Power MOSFETs and Their Applications
Texas InstrumentsAN-558 Introduction to Power MOSFETs and Their Applications
DSP Instruction Cache Performance on the OMAP5912
Texas InstrumentsDSP Instruction Cache Performance on the OMAP5912 Application Report
Biasing Considerations for OPA564 During Enabled and Disabled States
Texas InstrumentsThe OPA564 is a high-voltage high-current wide-bandwidth operational amplifier suitable for many applications. Among the many features available on the OPA564 is a disabled mode that is designed to be used for power savings in time multiplexed systems such as powerline communications. When using an op amp that can be placed into either the enabled state or disabled state (shutdown) it is critic
Selection and Specification of Crystals for TI's IEEE 1394 Physical Layers
Texas InstrumentsTo comply with the IEEE 1394 standard, each node in a 1394 bus must have a system clock of 49.152 MHz +/- 100 parts per million (ppm) (approximately 49.1471 MHz to 49.1569 MHz). For Texas Instruments
AN-71 Micropower Circuits Using the LM4250 Programmable Op Amp (Rev. B)
Texas InstrumentsThis application report describes the circuit operation of the Texas Instruments LM4250 various methodsof biasing the device frequency response considerations and some circuit applications exercising theunique characteristics of the LM4250.
Using the PT6100/6210/6300 as a Constant Current Source (Rev. A)
Texas InstrumentsUsing the PT6100/6210/6300 as a Constant Current Source
TMS320TCI6482 Power Consumption Summary (Rev. A)
Texas InstrumentsThis application report discusses the power consumption of the Texas Instruments TMS320TCI6482 digital signal processor (DSP). The power consumption on the TCI6482 device is highly application-dependent; therefore a power spreadsheet that predicts power consumption is provided along with this document. The power spreadsheet can be used for the purpose of modeling power consumption for user applic
AN-386 A Non-Complementary Audio Noise Reduction System (Rev. C)
Texas InstrumentsThe popularity of companding or complementary noise reduction systems is self-evident. Nearly allmedium to high quality cassette tape decks include either Dolby®B or Dolby C type noise reduction. Ascant few have different systems such as dbx or Hi-Com. The universal appeal of compandors to n.r.system designers is the amount of noise reduction they can offer yet one of the major reasons t
Digitally Programmable, Time-Continuous Active Filter
Texas InstrumentsProgrammable active filters have increased in popularity over the past decade. With the advent of switched capacitor topologies, filter parameters such as the natural frequency and filter Q can be cha
Understanding the Pwr Sup Require of PCI Bus Stnd-How to Protect the Dig Compnts (Rev. B)
Texas InstrumentsThis application report provides an analog design guide to the PCI system designers.
Multi-DC/DC Conversion & Color LED Control Integrated on a C2000 Microcontroller
Texas InstrumentsMulti-DC/DC Conversion & Color LED Control Integrated on a C2000 Microcontroller LED_SPRABR7_ZHCA515
TNETE2201 EVM Kit Setup and Usage
Texas InstrumentsThe Texas Instruments (TI)(tm) TNETE2201 EVM (evaluation module) kit is a tool used to evaluate and design high-speed prototypes using the TNETE2201 Ethernet Transceiver IC (10 mm x 10 mm TQFP plastic package). The EVM kit is used to evaluate device parameters while acting as a guide for high-speed board layout.The high-speed interface is selectable between a 50-ohm SMA connector and a GBIC s
Capacitive Touch Sensing, MSP430 Slider and Wheel Tuning Guide
Texas InstrumentsThis application report provides guidelines on how to tune capacitive touch sliders and wheels running on the MSP430? microcontrollers. It identifies the hardware and software parameters as well as ex
JEDEC Publication 95
Texas InstrumentsMany electronics companies have joined the Joint Electron Device Engineering Council (JEDEC) and the JC-11 Mechanical (Package Outline) Standardization committee to gain further understanding of industry package standards and to register their product lines. As a member of JC-11 the company receives a hardcopy of Publication 95 that generally is in the custody of the committee member. The publica
OMAP3530 Easy CUS Package PCB Escape Routing (Rev. A)
Texas InstrumentsThe OMAP3530 CUS package is designed with a new technology called Via Channel™ array. This technology allows for easy routing of the device in two signal and two power layers using standard 20 mil diameter and 10 mil finished hole size via; it is cost and time effective. This application report shows how to easily route the entire package by first routing one quadrant only and then copying i
