OMAP3530 Easy CUS Package PCB Escape Routing (Rev. A)

Texas Instruments

Published Date: 03/25/2010


The OMAP3530 CUS package is designed with a new technology called Via Channel™ array. This technology allows for easy routing of the device in two signal and two power layers using standard 20 mil diameter and 10 mil finished hole size via; it is cost and time effective. This application report shows how to easily route the entire package by first routing one quadrant only and then copying i


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