This document describes the theory of oversampling the hardware and software implementatin on the TMS320C240 and important aspects that need to be considered when using oversampling.The different techniques with their main advantages limitations and applications are covered in chapter 2. Chapter 3 describes the key implementation blocks that are required to implement oversampling on the TMS

This application report describes the theory of oversampling to achieve resolutions greater than the available bits for an analog-to-digital converter (ADC). An example is shown that utilizes this tec

TLK10022 Video Aggregation ? Display Port Interface Application Sheet

This application note provides an overview of the M-LVDS standard, introduces Texas Instrument?s current M-LVDS product portfolio, describes common M-LVDS applications, and details important design gu

This Application Note describes how to configure the LM3524 as a transformer isolated flyback power supply.

This application report describes how to set up an open source software-based development environment for the SimpleLink CC26xx and CC13xx wireless MCUs using Eclipse as integrated development environment (IDE).

Certain applications require that output voltage regulation be maintained when the input voltage is only slightly higher than the output voltage. For a buck converter these low headroom operating conditions require high duty cycle operation that may approach 100%. As the converter on-time duration approaches the switching period the charge on the BOOT capacitor must be maintained in order for th

One advantage of parallel processors (PPs) is that their performance is made scaleable by the addition of more processors to the system. Interprocesor communication is guaranteed by high-speed interfa

A DSP/BIOS AIC23 Codec Device Driver for the TMS320C5510 DSK Application Report

This application report contains implementation instructions for the Serial Rapid I/O (SRIO) interface on the TMS320C6455 DSP device. The approach to specifying interface timing and physical requirements for the SRIO interface is quite different than previous approaches for other interfaces.

Serial Rapid I/O is an industry-standard high-speed switched-packet interconnect. Physical layer data t

The SN74ABT3613 and SN74ABT3614 FIFOs contain the parity-generate and parity-check features needed for high-bandwidth and high-speed computing applications where demanding data integrity levels are required. This document discusses these features of the 36-bit FIFOs that are designed for fault-tolerant systems such as those found in computing and telecommunication systems.

This application report provides an overview of the need for, implementations of, and characteristics of electrical isolation in high-speed digital circuits. It discusses the advantages and disadvanta

AN-587 C in Embedded Systems and the Microcontroller World

This application note discusses driving LEDs using the LP3933 Back/Funlight Management IC system.

LB-19 Predicting OP Amp Slew Rate Limited Response

Application Note 1110 LVDS Quad Dynamic I CC vs Frequency

Using TI's CDCV304 with Backplane Transceiver (TLK1201, TLK1501, TLK2201, TLK2501, TLK2701, TLK3101)

The TI TC211 full frame charge coupled device (CCD) image sensor is used with the TCK-211 evaluation board to illustrate full frame CCD timing compatible with the EIA RS-170 standard. This document aids in the design of timing for the TI full frame CCD image sensors. The TC211 timing necessary to perform correlated double sampling (CDS) and antiblooming is included. This timing is only one method