This TPS659037 Operation With Higher Capacitive Loading application report addresses use-cases where external components demand a higher capacitive loading than the rating of the TPS659037 SMPS-outputs (57-μF maximum per phase). The specification of the device with a rating of nominal 47 μF and maximum of 57 μF holds true. Exceeding these values is at the risk of the user and requires thorough val

This application report describes the new features in Code Composer Studio Development Tools v3.3.

EMI Suppression of FPD-Link Device In Automotive Application (I) Written by Chinese Engineer

Charge pumps are dc/dc converters that use a capacitor instead of an inductor or transformer for energy storage. They are able to generate positive or negative voltages from the input voltage. The input voltage can be multiplied by some factor such as 0.5 2 3 and so on to generate the output voltage desired. Often charge pumps and all related parts (including those used for energy storage) ar

PLC PowerLine Brochure

TPS40170-Q1 Pin Open and Short Test Results

This application report is intended to help demystify the AIC27 example program that comes with the TMS320C5510? prototype board. The example program is intended to display some of the audio capabilities of the C5510? prototype board. Because it performs all these actions through header files and macros however it may seem unclear as to what is actually going on. This document clarifies what is

If you need more transducer excitation current than is available on a standard 4-20mA 2-wire current loop consider a 3-wire transmitter. A 2-wire 4-20mA transmitter uses the same two wires for signal and power. Part of the 4mA minimum loop current is used to power the transmitter circuitry. The remaining current can be used for transducer excitation. In some applications even the entire 4mA is no

Attention to layout is critical to the success of any battery management circuit board. The mixture of high-current paths with an ultralow-current microcontroller creates the potential for design issues that can be challenging to solve. This application report presents guidelines to ensure a stable and well-performing project.

The purpose of this design note is to explain how to use the different general digital output (GDO) pins for control and monitoring purposes. The focus is set on interfacing with a microcontroller unit (MCU) and is related to the CC1100 CC1101 CC1150 CC2500 and CC2550 devices.

This report discusses the theory and implementation of a 1200-bps splitband modem the Bell 212A/V.22. Throughout the report the terms Bell 212A and V.22 both refer to implemented modem. The report covers the following topics:- Modem Functional Blocks - Modem Transmitter - Modem Receiver- Modem Hardware Description - Analog Interface - Filters - Data Converter

As system bandwidths have increased an accurate estimate of the noise contribution for each element in the signal channel has become increasingly important. Many designers are not however particularly comfortable with the calculations required to predict the total noise for an op amp or in the conversions between the different descriptions of noise. Considerable inconsistency between manufactu

TAS3108EVM2 Application Note

DLPC300, DLP3000 Creating Multiple Bit Depth and Multiple Color Pattern Sequences for the DLP? Li DLPC300 DLPA035 /DLP/Application_Reports/

SN65LVDS348 and SN65LVDS349 are high-speed quadruple differential receivers with a wide common-mode input voltage range of –4 V to 5 V. Both these devices meet or exceed the requirements of the ANSI TIA/EIA-644A standard. This document compares the two devices.

The TPS56xx family of switching regulator controllers is designed to provide low voltages at high currents to today's digital signal processors such as the C5000 and C6000 families from TI, as well as

Configuring the bq27350 Data Flash

This application report discusses a solution to the additional power required in those PoE applications that exceed the power requirements defined in the current IEEE802.3af standard.

The short and long term reliability of National Semiconductor's interface circuits like any integrated circuit is very dependent on its environmental condition. Beyond the mechanical/environmental factors nothing has a greater influence on this reliability than the electrical and thermal stress seen by the integrated circuit. Both of these stress issues are specifically addressed on every inter