PCB EUROCARD FR4 1.27 & 2.54MM; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:0.35mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:DIN41612 Type C; Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:17 x 32 & 18 x 32; Hole Pitch:1.27mm; Material:Epoxy FR4; No. of Copper Coated Sides:2; No. of Holes:1120; PCB Size:100 x 160 mm; Pad Area:1.00 mm² / 2.00 mm²; Pitch Spacing:1.27mm

MULTIADAPTOR SMD FR4 QFP; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:PLCC QFP; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:120mm; External Length / Height:120mm; External Width:175mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxy FR4; No. of Copper Coated Sides:2; PCB Size:120 x 175 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

Epoxy fibre-glass FR4 1.50 mm, Double-sided 35 m Cu, Plated through holes (PTH), Hole diameter 1.00 mm

Epoxy fibre-glass FR4 1.50 mm, Double-sided 35 m Cu, Plated through holes (PTH), Hole diameter 1.00 mm

ADAPTOR QFP 256 264 224 232; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:Prototype Board; Copper Coating Density:35 um 2-side extremly planar; External Height:68.7mm; External Width:84mm; Hole Diameter:1mm; Hole Matrix:Adaption for QFP 256 264 (0.50 mm) and QFP 224 232 (0.40 mm); Pad Area:Pad distance 0.40 mm (15.7 mil) and 0.50mm (19.7mil)

MULTIADAPTOR SMD FR4 TSOP I/II; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSOP-1 & TSOP-2; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:72.2mm; External Length / Height:72.2mm; External Width:76.2mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Size:72.60 x 72.20 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

ADAPTOR SMD 0.50MM 20 24PIN; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSOP-1 20-24 Pin; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:16.5mm; External Length / Height:16.5mm; External Width:30.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:24; PCB Size:30.5 x 16.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD 0.8MM 40-44PIN; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSOP-2 40-44 Pin; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:29mm; External Length / Height:29mm; External Width:30.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:44; PCB Size:30.5 x 29.0 mm; Pad Diameter:1.5mm

MULTIADAPTOR MSOP-10 FR4 EPOXY; Pitch Spacing:2.54mm; Row Pitch:0.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:MSOP-10; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:10.4mm; External Length / Height:10.4mm; External Width:18.23mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:10; PCB Size:18.10 x 10 40 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS SOT-89; Convert From:SOT-89; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS SOT-23-6; Convert From:6-SOT-23; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS SDIP-32; Convert From:32-SDIP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

PCB ADAPTOR SMD SSOP-16 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-16; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:13mm; External Length / Height:13mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:16; PCB Size:13.0 x 23.5 mm; Pad Diameter:1.5mm

MULTIADAPTOR SMD FR4 SO/SOJ; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:58.5mm; External Length / Height:58.5mm; External Width:88mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Size:58.5 x 88 0; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

MULITADAPTOR SMD FR4 TSSOP; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:58.9mm; External Length / Height:58.9mm; External Width:120.1mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Size:58.9 x 120.1; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

ADAPTOR SMD TSSOP-20 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-20; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:16mm; External Length / Height:16mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:20; PCB Size:16.0 x 23 5 mm; Pad Diameter:1.5mm

MULTI-ADAPTOR 17.7X37.4MM TSSOP-28; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-28; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:37.4mm; External Width:17.7mm; Hole Diameter:1mm

ADAPTOR SMD TSSOP-48 0.50MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-48; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:27mm; External Length / Height:27mm; External Width:34.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:48; PCB Size:27.0 x 34 5 mm; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS QFN/QFP-40; Convert From:40-QFP 40-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:RE935 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS SOP-32; Convert From:32-SOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:RE936 Series; SVHC:No SVHC (17-Dec-2015)