Description

MULTIADAPTOR SMD FR4 TSOP I/II; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSOP-1 & TSOP-2; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:72.2mm; External Length / Height:72.2mm; External Width:76.2mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Size:72.60 x 72.20 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm