IC ADAPTOR FIBREGLASS MSOP-8; Convert From:8-MSOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

PCB IC ADAPTER 10-MSOP 10.16MM; Convert From:10-MSOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:10.16mm; Product Range:-; SVHC:No SVHC (15-Jan-2019)

PCB IC ADAPTER 6-SOT-23 7.62MM; Convert From:6-SOT-23; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (15-Jan-2019)

PCB IC ADAPTER 3-TO-252 10.16MM; Convert From:3-TO-252; Convert To:-; Pitch Spacing:-; Row Pitch:10.16mm; Product Range:-; SVHC:No SVHC (15-Jan-2019)

PCB ADAPTOR SMD SSOP-16 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-16; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:13mm; External Length / Height:13mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:16; PCB Size:13.0 x 23.5 mm; Pad Diameter:1.5mm

MULTIADAPTOR SMD FR4 SO/SOJ; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:58.5mm; External Length / Height:58.5mm; External Width:88mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Size:58.5 x 88 0; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

MULITADAPTOR SMD FR4 TSSOP; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:58.9mm; External Length / Height:58.9mm; External Width:120.1mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Size:58.9 x 120.1; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

ADAPTOR SMD TSSOP-20 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-20; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:16mm; External Length / Height:16mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:20; PCB Size:16.0 x 23 5 mm; Pad Diameter:1.5mm

MULTI-ADAPTOR 17.7X37.4MM TSSOP-28; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-28; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:37.4mm; External Width:17.7mm; Hole Diameter:1mm

ADAPTOR SMD TSSOP-48 0.50MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-48; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:27mm; External Length / Height:27mm; External Width:34.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:48; PCB Size:27.0 x 34 5 mm; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS QFN/QFP-40; Convert From:40-QFP 40-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:RE935 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS SOP-32; Convert From:32-SOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:RE936 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS HTSOP/TSOP-56; Convert From:56-TSOP 56-HTSOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:38.1mm; Product Range:RE936 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS DIP-40; Convert From:40-DIP; Convert To:40-DIP; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:RE937 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS WLCSP-6; Convert From:6-WLCSP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:RE937 Series; SVHC:No SVHC (17-Dec-2015)

SOLDERABLE BREADBOARD 46.99MM X 55.24MM; Board Type:Solderable Breadboard; Board Material:Epoxy Fibreglass; Hole Diameter:1.1mm; External Height:46.99mm; External Width:55.24mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

SOLDERABLE BREADBOARD 57.78MM X 39.37MM; Board Type:Solderable Breadboard; Board Material:Epoxy Fibreglass; Hole Diameter:1.1mm; External Height:57.78mm; External Width:39.37mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS QFN-56; Convert From:56-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:RE965 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS QFP-64; Convert From:64-QFP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE966 Series; SVHC:No SVHC (17-Dec-2015)

PCB SOLDER PRACTICE BOARD CHALLENGER; Board Type:SMD Board; Board Material:Epoxy Glass Composite; Hole Diameter:-; External Height:100mm; External Width:140mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:DPAK Melf Minimelf Poti PLCC QFP so SOL SOT SOM TSOP; Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:100mm; Material:Epoxy FR4; No. of Copper Coated Sides:1; PCB Size:100 x 140 mm