ADAPTOR QFP 80 100; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:Prototype Board; Copper Coating Density:35 um 2-side; External Height:45.5mm; External Width:50.9mm; Hole Diameter:1mm; Hole Matrix:Adaption for QFP 80 (0.80 mm) and QFP 100 (0.65 mm); No. of Copper Coated Sides:2

ADAPTOR QFP 44 PLCC 28 44; Board Type:IC Adapter; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:40.9mm; External Width:38.4mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Copper Coating Density:35 um 2-side; Hole Matrix:Adaption for PLCC 28 44 (1.27 mm) and QFP 44 (0.80 mm)

ADAPTOR QFP 40 48 80; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:Prototype Board; Copper Coating Density:35 um 2-side extremly planar; External Height:35.5mm; External Width:35.5mm; Hole Diameter:1mm; Hole Matrix:Adaption for QFP 40 48 (0.50 mm) and QFP 80 (0.40 mm)

MULTIADAPTOR SMD FR4 24-144PIN; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:LQFP PQFP TQFP; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:57.2mm; External Length / Height:57.2mm; External Width:57.2mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxy FR4; No. of Copper Coated Sides:2; PCB Size:57.20 x 57.20 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS SOIC/SOP-8; Convert From:8-SOIC 8-WSOIC 8-SOP 8-HSOP 8-HTSOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

ADAPTOR SMD 0.5MM 28-48PIN; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSOP-1 28-48 Pin; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:26.5mm; External Length / Height:30.5mm; External Width:43.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:48; PCB Size:30.5 x 43.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD 1.27MM 20-32PIN; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSOP-2 20-32 Pin; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:26.5mm; External Length / Height:26.5mm; External Width:30.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:32; PCB Size:26.5. x 30.5 mm; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS SOT-23-10; Convert From:10-SOT-23; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

SMD-ADAPTOR PCB FR4 SC70 SOT23 ; Pitch Spacing:0.65mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SC-70 SOT23; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Connector Type:SC; Copper Coating Density:double-sided 35 µm; Copper Thickness:35µm; External Height:13.5mm; External Length / Height:13.5mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:0.3mm; Material:Epoxy Fibreglass FR4; No. of Copper Coated Sides:2; No. of Holes:8; PCB Size:13.5 x 23.5 mm; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS SOT-23-10; Convert From:10-SOT-23; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS SOT-23-8; Convert From:8-SOT-23; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS MSOP-8; Convert From:8-MSOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

FPC/FFC ADAPTOR FIBREGLASS 1.5MM; Convert From:Molex FPC/FFC; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

MULTI-ADAPTOR 18.4X22MM SSOP-16; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-16; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:22mm; External Width:18.4mm; Hole Diameter:1mm

MULTI-ADAPTOR 21.5X37MM SSOP-28; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-28; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:37mm; External Width:21.5mm; Hole Diameter:1mm

ADAPTOR SMD SO-16 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-16; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:13.5mm; External Length / Height:13.5mm; External Width:20.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:16; PCB Size:20.5 x 13.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD SO-20W 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-20W; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:16mm; External Length / Height:16mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:20; PCB Size:25.5 x 16.0 mm; Pad Diameter:1.5mm

MULTI-ADAPTOR 21X32MM WSOIC-24; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:WSOIC-24; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:32mm; External Width:21mm; Hole Diameter:1mm

ADAPTOR SMD SO-32 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-32; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:24mm; External Length / Height:24mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:32; PCB Size:25.5 x 24.0 mm; Pad Diameter:1.5mm

ADAPTOR SMD SOJ-40 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SOJ 40; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:25.5mm; External Length / Height:25.5mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:40; PCB Size:25.5 x 29.0 mm; Pad Diameter:1.5mm