PCB PAD PER HOLE 100 MM X 160 MM; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:-; External Height:100mm; External Width:160mm; Board Thickness:-; Product Range:-; SVHC:No SVHC (12-Jan-2017) ;RoHS Compliant: Yes

PCB SOLDER EXERCISE 72MM X 213MM; Board Type:Soldering Exercise Board; Board Material:Epoxy Fibreglass; Hole Diameter:-; External Height:72mm; External Width:213mm; Board Thickness:-; Product Range:-; SVHC:No SVHC (12- ;RoHS Compliant: Yes

PCB IC ADAPTER 4-SOP 7.62MM; Convert From:4-SOP; Convert To:-; Pitch Spacing:5.08mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (15-Jan-2019)

EUROBOARD RASPBERRY PI 100X160 MM; Accessory Type:Stackable DIP Euroboard; For Use With:Raspberry Pi; Product Range:-; SVHC:No SVHC (15-Jan-2019)

PCB IC ADAPTER 8-SOIC 7.62MM; Convert From:8-SOIC; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (15-Jan-2019)

PCB IC ADAPTER 8-SSOP 7.62MM; Convert From:8-SSOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (15-Jan-2019)

FPC/FFC ADAPTOR FIBREGLASS 1.5MM; Convert From:Molex FPC/FFC; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

MULTI-ADAPTOR 18.4X22MM SSOP-16; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-16; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:22mm; External Width:18.4mm; Hole Diameter:1mm

MULTI-ADAPTOR 21.5X37MM SSOP-28; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-28; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:37mm; External Width:21.5mm; Hole Diameter:1mm

ADAPTOR SMD SO-16 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-16; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:13.5mm; External Length / Height:13.5mm; External Width:20.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:16; PCB Size:20.5 x 13.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD SO-20W 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-20W; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:16mm; External Length / Height:16mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:20; PCB Size:25.5 x 16.0 mm; Pad Diameter:1.5mm

MULTI-ADAPTOR 21X32MM WSOIC-24; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:WSOIC-24; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:32mm; External Width:21mm; Hole Diameter:1mm

ADAPTOR SMD SO-32 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-32; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:24mm; External Length / Height:24mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:32; PCB Size:25.5 x 24.0 mm; Pad Diameter:1.5mm

ADAPTOR SMD SOJ-40 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SOJ 40; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:25.5mm; External Length / Height:25.5mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:40; PCB Size:25.5 x 29.0 mm; Pad Diameter:1.5mm

ADAPTOR SMD TSSOP-8 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-8; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:9mm; External Length / Height:9mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:8; PCB Size:9 x 23.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD TSSOP-56 0.50MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-56; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:27mm; External Length / Height:27mm; External Width:39.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:56; PCB Size:27.0 x 39 5 mm; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS QFN-56; Convert From:56-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE934 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS QFN/TQFN-44; Convert From:44-TQFP 44-QFP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE935 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS QFN/QFP-32; Convert From:32-QFP 32-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE935 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS LFCSP/QFN-20; Convert From:20-QFN 20-LFCSP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE935 Series; SVHC:No SVHC (17-Dec-2015)