Description

MULTIADAPTOR SMD FR4 QFP; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:PLCC QFP; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:120mm; External Length / Height:120mm; External Width:175mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxy FR4; No. of Copper Coated Sides:2; PCB Size:120 x 175 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm