PCF8598C-2
Part Number : PCF8598C-2
NXP Semiconductors N.V.1024 X 8-Bit CMOS EEPROM With I2C-Bus Interface
PESD3V3U1UL
Part Number : PESD3V3U1UL
NXP Semiconductors N.V.Leadless Ultra Small Plastic Package; 2 Terminals; Body 1.0 x 0.6 x 0.5 Mm
PESD5V0L1UB
Part Number : PESD5V0L1UB
NXP Semiconductors N.V.Plastic Surface-Mounted Package; 2 Leads
PESD5V0L1UL
Part Number : PESD5V0L1UL
NXP Semiconductors N.V.Leadless Ultra Small Plastic Package; 2 Terminals; Body 1.0 0.6 0.5 Mm
PESD5V0L7BS
Part Number : PESD5V0L7BS
NXP Semiconductors N.V.Plastic Small Outline Package; 8 Leads; Body Width 3.9 Mm
PESD5V0U1UA
Part Number : PESD5V0U1UA
NXP Semiconductors N.V.Plastic Surface-Mounted Package; 2 Leads
PESD5V0U4BW
Part Number : PESD5V0U4BW
NXP Semiconductors N.V.Plastic Surface-Mounted Package; 5 Leads
PESD5V0V1BA
Part Number : PESD5V0V1BA
NXP Semiconductors N.V.Plastic Surface-Mounted Package; 2 Leads
PESD5V0V1BB
Part Number : PESD5V0V1BB
NXP Semiconductors N.V.Plastic Surface-Mounted Package; 2 Leads
PESD5V0X1BT
Part Number : PESD5V0X1BT
NXP Semiconductors N.V.Plastic Surface-Mounted Package; 3 Leads
PESD9X7.0L
Part Number : PESD9X7.0L
NXP Semiconductors N.V.Leadless Ultra Small Plastic Package; 2 Terminals; Body 1.0 0.6 0.5 Mm
PTN3311DP
Part Number : PTN3311DP
NXP Semiconductors N.V.Plastic Thin Shrink Small Outline Package; 8 Leads; Body Width 3 Mm
SL2S1502FUD
Part Number : SL2S1502FUD
NXP Semiconductors N.V.Sawn, Bumped Wafer, 120 M, On Film Frame Carrier, Ci Between LA And LB = 23.5 Pf (Typical)
SL2S1412FUD
Part Number : SL2S1412FUD
NXP Semiconductors N.V.Sawn, Bumped Wafer, 120 M, On Film Frame Carrier, Ci Between LA And LB = 0 Pf (Typical)
SL2S2002FTB
Part Number : SL2S2002FTB
NXP Semiconductors N.V.Plastic Extremely Thin Small Outline Package; No Leads; 3 Terminals; Body 1 X 1.45 X 0.5 Mm; Ci Between LA And LB = 23.5 Pf (Typical)
SL2S5102FUD
Part Number : SL2S5102FUD
NXP Semiconductors N.V.Sawn, Bumped Wafer, 120 m, On Film Frame Carrier, Ci Between LA And LB = 97 Pf (Typical)
SL3S1013FUD/BG
Part Number : SL3S1013FUD/BG
NXP Semiconductors N.V.Bumped G2im+ Die On Sawn 8 120 m Wafer, 7 m Polyimide Spacer
TDA9898HL/V3
Part Number : TDA9898HL/V3
NXP Semiconductors N.V.Plastic Low Profile Quad Flat Package; 48 Leads; Body 7 7 1.4 Mm
