ESD Protection For High-Speed Interfaces

Plastic Low Profile Fine-Pitch Ball Grid Array Package; 208 Balls

Plastic Low Profile Quad Flat Package; 100 Leads; Body 14 x 14 x 1.4 Mm

MCU 32BIT ARM7TDMI 60MHZ LQFP-144; Product Range:LPC ARM7 Microcontrollers; No. of Bits:32bit; CPU Speed:60MHz; Program Memory Size:256KB; RAM Memory Size:16KB; No. of Pins:144Pins; MCU Case Style:LQFP; No. of I/O's:112I/O's; Architecture:ARM7TDMI; Embedded Interface Type:I2C SPI UART; Supply Voltage Min:1.65V; Supply Voltage Max:1.95V; Packaging:Each; MSL:-; SVHC:No SVHC (17-Dec-2015); Controller Family/Series:LPC22xx; MPU Core Size:16bit / 32bit; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Peripherals:ADC PWM Timer; Program Memory Size:256KB

Plastic Thin Fine-Pitch Ball Grid Array Package; 144 Balls; Body 12 x 12 x 0.8 Mm

Plastic Low Profile Quad Flat Package; 144 Leads; Body 20 x 20 x 1.4 Mm

Plastic Low Profile Quad Flat Package; 100 Leads; Body 14 14 1.4 Mm

Plastic Low Profile Quad Flat Package; 144 Leads; Body 20 20 1.4 Mm

Plastic Thin Fine Pitch Ball Grid Array Package, 180 Balls, Body 12 x 12 x 0.8 Mm

TFBGA208: Plastic Thin Fine-Pitch Ball Grid Array Package; 208 Balls; Body 12 X 12 X 0.7 Mm

Plastic Thin Fine-Pitch Ball Grid Array Package; 296 Balls

Plastic Thin Fine-Pitch Ball Grid Array Package; 296 Balls

MCU 32BIT ARM9 266MHZ TFBGA-296; Product Range:LPC ARM9 Microcontrollers; No. of Bits:32bit; CPU Speed:266MHz; Program Memory Size:-; RAM Memory Size:256KB; No. of Pins:296Pins; MCU Case Style:TFBGA; No. of I/O's:87I/O's; Architecture:ARM9; Embedded Interface Type:I2C SPI UART USB; Supply Voltage Min:2.7V; Supply Voltage Max:3.6V; Packaging:Each; MSL:-; SVHC:No SVHC (17-Dec-2015); Controller Family/Series:LPC3200; MPU Core Size:16bit / 32bit; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Peripherals:ADC PWM RTC Timer

MIFARE Desfire EV1 Contactless Multi-Application IC

Plastic Extremely Thin Small Outline Package; No Leads; 8 Terminals; Utlp Based; Body 3 x 2 x 0.5 Mm

Plastic Dual In-Line Compatible Thermal Enhanced Very Thin Quad Flat Package; No Leads;16 Terminals; Body 2.5 x 3.5 x 0.85 Mm

Plastic Thin Shrink Small Outline Package; 28 Leads; Body Width 4.4 Mm

Single-Chip 8-Bit Microcontroller

Plastic Thermal Enhanced Thin Shrink Small Outline Package; 28 Leads; Body Width 4.4 Mm; Lead Pitch 0.65 Mm; Exposed Die Pad

512 X 8-Bit CMOS EEPROM With I2C-Bus Interface