SL2S1502FUD

NXP Semiconductors N.V.

Part Number: SL2S1502FUD

Description

Sawn, Bumped Wafer, 120 M, On Film Frame Carrier, Ci Between LA And LB = 23.5 Pf (Typical)

Buy

Datasheet

Download datasheet for SL2S1502FUD by NXP Semiconductors N.V.

Sign up to Newsletter

About EDS
Advertise
Contact
Submit Data

Your Source for Online Electronic Component Datasheets

We give you instant and unrestricted access to a comprehensive resource of datasheets and other technical documents from our growing database of electronics parts, sourced directly from the top global electronics manufacturers.

Use our search engine to search, view and then download documents in PDF format - they are all available as a FREE resource for all readers.

Check stock levels and buy from the industries' leading suppliers with live Distributor Stock Levels & Pricing. Manufacturers can have their products and documents listed with us completely free of charge. Distributors can also have their inventory & pricing listed for free.

Web development by Strategies

Parts
Reference Designs
Evaluation Kits
Applications Notes
Manufacturers

Log In

Email*

Password*

Forgotten password?

Add to Library

Create New Library

Create new Library

Name