SL2S5102FUD

NXP Semiconductors N.V.

Part Number: SL2S5102FUD

Description

Sawn, Bumped Wafer, 120 m, On Film Frame Carrier, Ci Between LA And LB = 97 Pf (Typical)

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Datasheet

Download datasheet for SL2S5102FUD by NXP Semiconductors N.V.

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