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Multipurpose EM 25 mA / 10 V

300 mm Semi-/Fully-automated Probe System; Coaxial chuck, Thermal system for CM300, +30C to 300C, (ERS AC3 115/230 VAC 50/60 Hz)

200 mm Fully-automated On-Wafer Probing Solution for High-power Devices; AVAILABLE CHUCK OPTIONS: MicroVac chuck, coaxial, Au, 150 mm (6), Taiko wafer ready*

EPS150COAX; Digital high-definition TV option for EPS packages containing C-mount HDTV camera, cables, power supply and 22 monitor, with crosshair overlay

WinCal XE, LRM, GSG

WinCal XE, W-band, mmWave ready (220 GHz), GSG, 100-150 m

High-Performance DC Parametric Probe, Thermally-stable probe arms for DCP-HTR (for DCM positioners, coax)

WinCal XE, GSG (550-1250 m)

Compact, portable automated wafer-level reliability test system: Supported Module Types: AHCI

WinCal XE, W-band, Right angle, GSG, 100-400 m pitch

WinCal XE, GSGSG (100 m)

EPS150COAX; VIB600 enhanced vibration-isolation platform

200 mm manual station package for high-resolution coaxial measurement, including: PM8 probe station, probe platen

200 mm Semi-automated Probe System

Probe station platform, semi-automated with MicroChamber

Summit Thermal Chucks; Coaxial chuck, thermal, -60C to 300C (ERS AirCool3), 200 mm (8 in.)

MPS150-based Application; 150 mm manual probing solution for low-noise measurements

200 mm Manual Probe System

MPS150-based Application; 150 mm manual probing solution for failure analysis

MPS150-based Application; 150 mm manual probing solution for DC parametric test (including platen lift)