TCF160-01180118-020-1PC

TCF Ultra-Thin Carbon Fiber Thermal Pads

Features:

• Soft surface
• Good compressibility
• Low thermal impedance
• Good thermal stability
• Ultra-thin design
• Highly flexible, can replace thermal grease material

Applications:

• Graphic Processors
• Base Stations
• Microprocessors
• Telecommunications

Specifications:

LEADER TECH SERIES [TCF160](https://www.electronicsdatasheets.com/manufacturers/leader-tech/parts/tcf160-01180118-020-1pc) [TCF200](https://www.electronicsdatasheets.com/manufacturers/leader-tech/parts/tcf200-01180118-020-1pc) [TCF250](https://www.electronicsdatasheets.com/manufacturers/leader-tech/parts/tcf250-01180118-020-1pc) [TCF350](https://www.electronicsdatasheets.com/manufacturers/leader-tech/parts/tcf350-01180118-020-1pc)     Thermal Conductivity Z (W/m-K) 16 20 25 35   Thermal Conductivity X,Y (W/m-K) 10 10 10 10   Thermal Resistance (°C-in^2/W; @20Psi) ≤ 0.2 ≤ 0.18 ≤ 0.15 ≤ 0.05   Color Gray Black Gray Black Gray Black Gray Black   Thickness (in) 0.010 - 0.118 0.020 - 0.118 0.020 - 0.118 0.010 - 0.031   Density (lb/in^3) 0.123 0.119 0.108 0.067   Hardness (Shore 00) 65 65 65 65   Compression Ratio @50 Psi (%) ≥ 40 ≥ 40 ≥ 40 ≥ 30   Operating Temperature (°F) -58 to 356 -58 to 356 -58 to 356 -58 to 356