Development can begin now for the TMS320C6414, TMS320C6415, and TMS320C6416 highest-performance digital signal processor (DSP) systems. Because of the compatibility between TMS320C6000? generation dev

OMAP4 Standard USB Usage WTBU/OMAP/AR

DRV8800, DRV8801 DRV8800, DRV8801 Driving Devices in Parallel Application Report

AN-147 Low Cost IC Stereo Receiver

The OMAP? architecture devices contain a nine-channel system DMA useable for block transfers of data without intervention by the TIARM925T MPU or the TMSC55x DSP. This application report describes optimization techniques for improving throughput. Examples are given for using external memories such as SDRAM and SRAM for transferring data to and from internal memory. Internal memory transfers are a

This application note describes the design criteria and the design process for a <b>folded dipole antenna</b> for the <b>CC2400, CC2420, CC2430, CC2431</b>, and <b>CC2480</b> devices. The design is ba

Selecting Amplifiers, ADCs, and Clocks for High-Performance Signal Paths

This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB).

Today's digital signal processor (DSP) architectures are confronted with the tough requirement of addressing a wide-range of standards and meeting a cost-effective performance/power trade-off. Increasing raw million instructions per second (MIPS) performance just by running at a higher frequency is not possible anymore since leakage is becoming a dominant factor with shrinking silicon geometries.

AN-1002 ADC16071/ADC16471 Analog Layout and Interface Design Considerations

This application report describes a method for real-time processing of images captured using a CCD (charge-coupled device) video camera using the Texas Instruments (TITM) TMS320C4x digital signal processor (DSP). The TI TMS320C4x is one of five generations of digital signal processors in the TI TMS320 family. The parallel processing ability of the TI TMS320C4x supplies the necessary performanc

This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

http://processors.wiki.ti.com/index.php/AM35x_VCA_PCB_layout.

The ZCN package is designed with a new technology called Via Channel™ Array (VCA). This technology allows Ball

Wide Bandwidth Receiver Implementation by Interleaving Two Giga-Sampling ADCs ADC12D1800RF, LMK04808, ADC12D1600RF

Using NiMH and Li-Ion Batteries in Portable Applications

This application report describes LP5521 programming commands and provides examples for the user.

This application report describes a low-cost highly-flexible composite USB keyboard implementation based on MSP430F5xx/MSP430F6xx families. Schematics and software are included allowing for an easy implementation and customization.The document explains basic necessary concepts but familiarity with the MSP430™ USB Developers Package (MSP430USBDEVPACK) and USB HID specification is assumed.

Linear and Switching Voltage Regulator Fundamental Part 1

DN611 -- Design Notes

AN-924 Dose Rate Response of Advanced CMOS Products