Application notes from Texas Instruments

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Application Notes from Texas Instruments

Absolute Maximum Ratings for Soldering (Rev. D)

Texas Instruments

Absolute Maximum Ratings for Soldering

Enable Functionality and Adjusting Under Voltage Lockout for TPS57112-Q1 Device

Texas Instruments

Enable Functionality and Adjusting Under Voltage Lockout for TPS57112-Q1 Device /HVAL/MSA/Power/2-App_Reports

Clocking High Speed Serial Links with LMK033X8 (Rev. A)

Texas Instruments

This application report outlines the advantages of using ultra-high performance clock generators from Texas Instruments to generate system clocks needed for high-speed serial links. A methodology for deriving reference clock jitter requirements for high-speed Ethernet link is described and the advantages of clocking such a system with the LMK03328 as opposed to discrete crystal oscillators are ou

Host System Calibration Method (Rev. B)

Texas Instruments

To add improvements to the Impedance Track™ algorithm changes have been made to free up firmwarecode space. In the process of freeing up code space the calibration calculations are no longerautomatically performed by the gauge but must be performed by the host and the results written back tothe gauge. This application note provides a flow on how to implement the calibration algorithm on a

MOSFET power losses and how they affect power-supply efficiency

Texas Instruments

TPS6598x Configuration Import Guide

Texas Instruments

TPS6598x Configuration Import Guide TPS65982 and TPS65986 /HVAL/ACS/2-App_Reports

AN-2029 Handling & Process Recommendations (Rev. E)

Texas Instruments

This application report provides recommendations for handling, storing, and mounting Texas Instruments' surface mount IC packages.

The final manufacturing yield and board level reliability are influenced by various factors and processes outside the control of the IC manufacturer. This application note is intended only as a guideline or reference. Due to the variety of possible board assembly materials and equipments, Texas Instruments advises the user to consult their individual suppliers and vendors.

QML Class V Process Optimizations (Rev. A)

Texas Instruments

QML Class V Process Optimizations

Reverse Current Protection in Load Switches

Texas Instruments

Reverse current occurs when current travels from output to input (rather than from input to output) asFigure 1 shows. This application note outlines where reverse current comes from why it can be harmful toa system and how to modify a design to provide protection from reverse current in a system.

Battery-Less NFC/RFID Temperature Sensing Patch (Rev. A)

Texas Instruments

NFC/RFID enables communication with transponders. The transponders include memory that can store various information including URLs Bluetooth® connection handover contact information diagnostics and now sensor measurement data. Battery-less sensor measurements that utilize energy harvesting from the RF field can be implemented in applications ranging from medical health and fitness and indus

High Voltage Half Bridge Design Guide for LMG3410 Smart GaN FET (Rev. A)

Texas Instruments

As gallium nitride (GaN) power FETs become readily available for power designers to use, their promise of performance improvement with higher efficiencies and greater power densities can begin to become realized. By having better material properties over silicon, loss elements such as on-state resistance Rds(on) and output capacitance Coss are smaller for an equal die area. These GaN power FET devices, included in the LMG3410x family, are typically offered in high electron mobility transistor (HEMT) structures, which along with maximizing the material property benefits eliminate the reverse recovery Qrr when the device operates in third quadrant mode (conduction from source to drain). These benefits allow GaN power FETs to operate faster and at higher frequencies than previously capable. With typical slew rates around 30 V/ns to 100 V/ns at operating voltages around 380 V to 480 V, printed circuit board (PCB) layout optimization is even more essential since parasitic inductances and capacitances from poor layouts can drastically reduce performance or even prevent operation. When pushed to their limits to maximize system gains power GaN FETs provide the device can degrade and potentially overheat without a carefully designed thermal system to dissipate the generated heat. To prevent these problems from hampering designs and limiting performance layout recommendations, peripheral component selection and thermal system design are discussed.

A Guide to Debugging With CCS on the DRA7xx, TDA2xx and TDA3xx Family of Devices

Texas Instruments

A Guide to Debugging With CCS on the DRA7xx, TDA2xx and TDA3xx Family of Devices

Using LMZ31710 for Higher Output Voltages

Texas Instruments

The LMZ31710 power module has been designed and characterized for operation at output voltages from0.6 V to 5.5 V. However several applications require higher voltages than the standard point-of-loadvoltages that the LMZ31710 is designed for. Following the guidance in this application note theLMZ31710 can be used for output voltages up to 9.5 V. All data included in this application note h

Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. C)

Texas Instruments

This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs.

TRF79xxA HF-RFID Reader Layout Design Guide (Rev. A)

Texas Instruments

This application note describes suggested guidelines for use in the laying out the TRF79xxA family of HF RFID readers. As each customer’s implementation will be different it is the customer's responsibility to ensure that all the proper methodologies and techniques are followed to ensure optimal performance.

LMH1980 Sync Separator Design Considerations in Cable Hot-Plug Applicatio

Texas Instruments

In a video receiver a sync separator’s function is to recover the sync timing embedded in an analog videosignal and output the sync pulses to the timing subsystem. This allows the timing subsystem to lock orsynchronize its local timebase to the recovered sync pulses so it can reliably capture process displayand/or re-transmit the incoming video data. The LMH1980 is a sync separator devic

TI DSP Benchmarking

Texas Instruments

This application report provides benchmarks for the C674x DSP core the C66x DSP core and the ARM®Cortex®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.

Benchmarking the Signal Processing Capabilities of the Low-Energy Accelerator (Rev. A)

Texas Instruments

This application report covers the performance of a low-energy accelerator (LEA) in performing advanced signal processing while maintaining the ultra-low-power consumption on a 16-bit MSP430? FRAM mic

Antenna Tuning for RF37S114 Tag Maximum Read Range

Texas Instruments

This application report provides performance data for the RF37S114 tag with various antenna sizes. Antenna design for a specific tag is an integral part in the NFC/RFID communication system. By maximizing antenna read range, potential hindrances, such as size and space limitations or physical dimensions, can be overcome. For example, the RF37S114 tag has a size of 4 mm × 4 mm, and by selecting the optimized antenna solution, the designer can be sure that all application requirements can be met.