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Application Notes from Texas Instruments

Implementing DDR2 PCB Layout on the TMS320TCI6482 (Rev. C)

Texas Instruments
This application report contains implementation instructions for the DDR2 interface contained on the TCI6482 DSP device. The approach to specifying interface timing for the DDR2 interface is quite different than on previous devices.

The previous approach specified device timing in terms of data sheet specifications and simulation models. The customer was required to obtain compatible memory de

Software PLL Design Using C2000 MCUs Three Phase Grid Connected Inverter (Rev. A)

Texas Instruments
Grid connected applications require an accurate estimate of the grid angle to feed power synchronous to the grid. This is achieved using a software phased-locked loop (PLL). This application report discusses the different challenges in the design of software phased-locked loops for three phase grid connected inverters and presents a methodology to design phased-locked loops using C2000 controllers

Thermistor Temperature Transducer to ADC Application

Texas Instruments
An interchangeable-thermistor temperature-measurement application is described and a basic framework circuit which can be modified to use alternative components is provided. When a potentiometer is used instead of a thermistor the application can also be used to measure other process variables. A basic understanding of active and passive analog devices is assumed.

AN-904 An Introduction to the Differential SCSI Interface

Texas Instruments
Application Note 904 An Introduction to the Differential SCSI Interface

Passive RFID Application Using MSP430F2274

Texas Instruments
This application report describes a reference design implementing a battery-less RFID application that includes an E-Paper display, using the PaLFI eZ430-TMS37157 RFID board. The sample application co

Electrostatic Discharge (ESD) Protective Semiconductor Packing Materials and Con (Rev. A)

Texas Instruments
Electrostatic Discharge (ESD) Protective Semiconductor Packing Materials and Configurations

Power Control Design Key To Realizing Infiniband Benefits

Texas Instruments
As a new interface, InfiniBand (sm) presents a lot of expansion opportunities. However, in most new specifications, the true implementation details for the power requirements are either limited or lac

Simultaneous-Switching Performance of TI Logic Devices (Rev. B)

Texas Instruments
Simultaneous-switching noise can generate and propagate glitches in electronic systems. Therefore system designers are faced with challenges to minimize simultaneous-switching noise while increasing switching speed and improving signal quality. This report presents the performance of different TI logic devices under various simultaneous-switching conditions. Factors such as the number of bits sw

Analyzing Power Modules

Texas Instruments
Analyzing Power Modules

Using the TPS23753A with an External Error Amplifier

Texas Instruments
TPS23753A Using the TPS23753A with an External Error Amplifier

LM27965 Dual Display White LED Driver w/I2C Compatible Brightness Control (Rev. B)

Texas Instruments
This application note describes how to operate the LM27965 Evaluation Module.

TMS320C6000 Host Port to the i80960 Microprocessors Interface (Rev. A)

Texas Instruments
This application report describes the interface between the Texas Instruments (TI) TMS320C6000™ digital signal processor (DSP) host port and the Intel 80960 microprocessor. The document includes schematics showing connections between the two devices PAL equations and verification that timing requirements are met for each device (tables and timing diagrams).

Bootloading the TMS320C548 Using the BSP in Standard Mode

Texas Instruments
This document describes how to create a boot package and bootload one Texas Instruments (TI)(tm) TMS320C548 digital signal processor (DSP) with another TMS320C54x DSP.

Interfacing the DAC8814EVM to MSP430 Processors

Texas Instruments
This application report presents a method for interfacing the DAC8814 - a four-channel, current output, 16-bit multiplying digital-to-analog converter - to the MSP430F449 processor using the HPA449 fr

SPARC MBus-to-Futurebus+ Bridge Using The TI Futurebus+ Chipset (Rev. A)

Texas Instruments
This document describes the logic to connect the SPARC Mbus to the TI Futurebus+ (FB+) chipset host interface (HIF). This logic is a translator of Mbus to HIF transactions and vice versa. Direct and paged-memory are described along with techniques for a 64-bit-only data path and a dynamically configurable 32-bit Mbus/32-bit HIF or 64-bit Mbus/64-Bit HIF.

U-155 Implementing Multi-State Charge Algorithm with the UC3909 Switchmode

Texas Instruments
This application note introduces a new dedicated analog controller. The UC3909 Switchmode Lead-Acid Battery Charger IC provides a low-cost solution to battery charging without sacrificing the performance of the system. Also the paper will guide users whose primary expertise is not switch-mode power-supply design in devising a state-of-the-art multi-state battery charger using the new IC. Th

Launchpad-Based MSP430 UART BSL Interface (Rev. A)

Texas Instruments
This application report describes the implementation of the low-cost LaunchPad™-based MSP430 universal synchronous receiver/transmitter (UART) bootstrap loader (BSL) interface. The goal of the implementation is to deploy the MSP430 Value Line devices that have less than two serial interface modules as the bridge between the BSL Scripter software tool and the MSP430 target device.

Interoperability of M-LVDS and BusLVDS

Texas Instruments
M-LVDS is standardized in TIA/EIA-899 to enable interoperability of compliant interface circuits such as the SN65MLVD200 from Texas Instruments. This report compares data sheet specifications and makes a conclusion on the interoperability of the nonstandard BusLVDS (BLVDS) DS92LV010A from National Semiconductor and the SN65MLVD200.

Power Management Design for Applications Processors

Texas Instruments
Power Management Design for Applications Processors

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