PROTOTYPING BOARD DUAL INLINE FR2; Board Type:Eurocard; Board Material:Epoxy Paper; Hole Diameter:1mm; External Height:160mm; External Width:100mm; Board Thickness:-; Product Range:-; SVHC:No SVHC (17-Dec-2015)

Epoxy fibre-glass FR4 1.50 mm, Single-sided 35 m Cu, Hot air leveling (HAL-leadfree), Hole diameter 1.00 mm

PCB EUROCARD FR4 STRIPES 2.54MM; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:DIN41612 Type C; Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:38 x 61; Hole Pitch:2.54mm; Material:Epoxy FR4; No. of Copper Coated Sides:1; No. of Holes:2318; PCB Size:100 x 160 mm; Pad Area:2; Pitch Spacing:2.54mm; Row Pitch:2.54mm

PCB EUROCARD FR2 STRIPES; Board Type:Eurocard; Board Material:Epoxy Paper; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:DIN41617; Copper Coating Density:Organic Surface Protection 0 30 µm; Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:37 x 57; Material:SRBP FR2; No. of Copper Coated Sides:1; No. of Holes:2109; No. of Strips:37; PCB Size:100 x 160 mm; Pitch Spacing:2.54mm; Row Pitch:2.54mm

PCB EUROCARD FR4 STRIPES; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:DIN41617; Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:37 x 57; Material:Epoxy FR4; No. of Copper Coated Sides:1; No. of Holes:2109; No. of Strips:37; PCB Size:100 x 160mm; Pitch Spacing:2.54mm; Row Pitch:2.54mm

PCB EUROCARD FR4 DIRECT CONNCTR; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:37 x 57; Material:Epoxy FR4; No. of Copper Coated Sides:1; No. of Holes:2109; No. of Strips:37; PCB Size:100 x 160mm; Pitch Spacing:2.54mm; Row Pitch:2.54mm

PCB EUROCARD FR4 STRIPES 2 54MM; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:DIN41612 Type H; Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:37 x 56; Material:Epoxy FR4; No. of Copper Coated Sides:1; No. of Holes:2072; PCB Size:100 x 160 mm; Pitch Spacing:2.54mm; Row Pitch:2.54mm

ADAPTOR QFP 80 100 108; Board Type:IC Adapter; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:43.3mm; External Width:43.3mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Copper ;RoHS Compliant: Yes

Epoxy fibre-glass FR4 1.50 mm, Double-sided 35 m Cu, Plated through holes (PTH), Surface chem. Ni/Au with soldering stop mask

ADAPTOR SMD 0.40MM 28-60PIN; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSOP-1 28-60 Pin; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:29mm; External Length / Height:29mm; External Width:43.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:60; PCB Size:43.5 x 29.0 mm; Pad Diameter:1.5mm

MULTIADAPTOR MSOP-08 EPOXIED FR4; Pitch Spacing:2.54mm; Row Pitch:0.65mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:MSOP-8; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:10.4mm; External Length / Height:10.4mm; External Width:16.2mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:8; PCB Size:16.20 x 10.40 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

RS232 ADAPTOR FIBREGLASS 1.5MM; Convert From:RS232; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; SVHC:No SVHC (17-Dec-2015)

MULTIADAPTOR SMD FR4 SSOP; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:61.4mm; External Length / Height:61.4mm; External Width:81.7mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Size:61.40 x 81.70 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

ADAPTOR SMD SO-8W 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-8W; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:8mm; External Length / Height:8mm; External Width:20.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:8; PCB Size:20.5 x 8 0 mm; Pad Diameter:1.5mm

ADAPTOR SMD TSSOP-14 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-14; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:13.5mm; External Length / Height:13.5mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:14; PCB Size:13.5 x 23.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD TSSOP-16 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-16; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:13.5mm; External Length / Height:13.5mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:16; PCB Size:13.5.x 23.5 mm; Pad Diameter:1.5mm

MULTI-ADAPTOR 15X22.6MM TSSOP-16; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-16; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:22.6mm; External Width:15mm; Hole Diameter:1mm

IC ADAPTOR FIBREGLASS QFN/QFP-44; Convert From:44-QFP 44-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE934 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS QFN/QFP-48; Convert From:48-QFP 48-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE934 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS QFP-32; Convert From:32-QFP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:RE934 Series; SVHC:No SVHC (17-Dec-2015)