Description

MULTIADAPTOR MSOP-08 EPOXIED FR4; Pitch Spacing:2.54mm; Row Pitch:0.65mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:MSOP-8; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:10.4mm; External Length / Height:10.4mm; External Width:16.2mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:8; PCB Size:16.20 x 10.40 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm