IC ADAPTOR FIBREGLASS 0805/0603/0402; Convert From:0805 0603 0402; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS SOT-223; Convert From:SOT-223; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS DFN/MSOP-10; Convert From:10-DFN 10-MSOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

ADAPTOR SMD SSOP-24 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-24; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:19.5mm; External Length / Height:19.5mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:24; PCB Size:19.5 x 23.5 mm; Pad Diameter:1.5mm

PCB ADAPTOR SMD SO-8 20.5MMX8MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-8; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1; Copper Thickness:35µm; External Height:8mm; External Length / Height:8mm; External Width:20.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxy Fibreglass FR4; No. of Copper Coated Sides:2; No. of Holes:8; PCB Size:20.5 x 8.0 mm; Pad Diameter:1.5mm

MULTI-ADAPTOR 21.2X28MM WSOIC-20; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:WSOIC-20; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:28mm; External Width:21.2mm; Hole Diameter:1mm

ADAPTOR SMD SO-24W 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-24W; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:18.5mm; External Length / Height:18.5mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:1.27mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:24; PCB Size:25.5 x 18.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD SO-28W 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-28W; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:21mm; External Length / Height:21mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:28; PCB Size:21.0 x 25.5 mm; Pad Diameter:1.5mm

MULTI-ADAPTOR 11.8X15.2MM TSSOP-8; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-8; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:15.2mm; External Width:11.8mm; Hole Diameter:1mm

MULTI-ADAPTOR 15.5X20MM TSSOP-14; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-14; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:20mm; External Width:15.5mm; Hole Diameter:1mm

MULTI-ADAPTOR 15.4X27.7MM TSSOP-20; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-20; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:27.7mm; External Width:15.4mm; Hole Diameter:1mm

ADAPTOR SMD TSSOP-24 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-24; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:18.5mm; External Length / Height:18.5mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:24; PCB Size:18.5 x 23.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD TSSOP-28 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-28; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:21mm; External Length / Height:21mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:28; PCB Size:21.0 x 23.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD TSSOP-38 0.50MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSSOP-38; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:23.5mm; External Length / Height:23.5mm; External Width:28.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:38; PCB Size:28.5 x 23.5 mm; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS QFP-32; Convert From:32-QFP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE934 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS TQFP-32 TO 100; Convert From:32-TQFP to 100-TQFP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:RE934 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS QFN/QFP-32; Convert From:32-QFP 32-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:15.24mm; Product Range:RE935 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS QFN-16; Convert From:16-QFN; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:RE935 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS HTSOP/TSOP-56; Convert From:56-TSOP 56-HTSOP; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:38.1mm; Product Range:RE936 Series; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS DIP-8; Convert From:8-DIP; Convert To:8-DIP; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:RE937 Series; SVHC:No SVHC (17-Dec-2015)