Robust 5 kV RMS Isolated RS-485/RS-422 Transceiver with Level 4 EMC and Full 42 V Protection Features: 5 kV rms isolated RS-485/RS-422 transceiver ±42 V ac/dc peak fault protection on RS-485 bus pins Certified Level 4 EMC protection on RS-485 A, B bus pins IEC 61000-4-5 surge protection (±4 kV) IEC 61000-4-4 electrical fast transient (EFT) protection (±2 kV) IEC 61000-4-2 electrostatic discharge (ESD) protection ±8 kV contact discharge ±15 kV air discharge IEC 61000-4-6 conducted radio frequency (RF) immunity (10 V/m rms) Certified IEC 61000-4-x immunity across isolation barrier IEC 61000-4-2 ESD, IEC 61000-4-4 EFT, IEC 61000-4-5 surge, IEC 61000-4-6 conducted RF immunity, IEC 61000-4-3 radiated immunity, IEC 61000-4-8 magnetic immunity RS-485 A, B pins human body model (HBM) ESD protection: >±30 kV Safety and regulatory approvals (pending) CSA Component Acceptance Notice 5A, DIN V VDE V 0884-10, UL 1577, CQC11-471543-2012 TIA/EIA RS-485/RS-422 compliant over full supply range 3 V to 5.5 V operating voltage range on VDD2 1.7 V to 5.5 V operating voltage range on VDD1 logic supply Common-mode input range of −25 V to +25 V High common-mode transient immunity: >75 kV/μs Robust noise immunity (tested to the IEC 62132-4 standard) Passes EN55022 Class B radiated emissions by 6 dBμV/m margin Receiver short-circuit, open-circuit, and floating input fail-safe Supports 256 bus nodes (96 kΩ receiver input impedance) −40°C to +125°C temperature option Glitch free power-up/power-down (hot swap)ADM2795E-EP supports defense and aerospace applications (AQEC standard) Download ADM2795E-EP data sheet (pdf) Military −55°C to +125°C temperature range Controlled manufacturing baseline 1 assembly/test site Enhanced product change notification Qualification data available on request V62/17611 DSCC Drawing Number

5.7 kV RMS 500kbps Half Duplex Signal and Power Isolated RS-485 Transceiver with 15 kV IEC ESD Features: 5.7 kV rms isolated RS-485/RS-422 transceiver Low radiated emissions, integrated, isolated dc-to-dc converter Passes EN 55032 Class B with margin on a 2-layer PCB Cable invert smart feature Correct reversed cable connection on A, B, Y, and Z bus pins while maintaining full receiver fail-safe feature ESD protection on RS-485 A, B, Y, and Z pins 12 kV IEC61000-4-2 contact discharge 15 kV IEC61000-4-2 air discharge High speed 25 Mbps data rate (ADM2865E/ADM2867E) Low speed 500 kbps data rate for EMI control (ADM2861E/ADM2863E) Flexible power supplies Input VCC supply of 3 V to 5.5 V Logic VIO supply of 1.7 V to 5.5 V VSEL pin to select VISO supply of 5 V (VCC > 4.5 V) or 3.3 V PROFIBUS compliant for 5 V VISO Wide operating temperature range: −40°C to +105°C High common-mode transient immunity: 250 kV/μs Short-circuit, open-circuit, and floating input receiver fail-safe Supports 192 bus nodes (72 k receiver input impedance) Full hot swap support (glitch free power-up/power-down) Safety and regulatory approvals (pending) CSA Component Acceptance Notice 5A, DIN V VDE V 0884-11, UL 1577, CQC11-471543-2012, IEC 61010-1 Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E) 28-lead, fine pitch SOIC_W package (10.15 mm 10.05 mm) with >8.0 mm creepage and clearance

3.0 V to 5.5 V, 12 kV IEC ESD Protected, 500 kbps/50 Mbps RS-485 Transceiver Features: TIA/EIA RS-485 compliant over full supply range 3.0 V to 5.5 V operating voltage range on VCC 1.62 V to 5.5 V VIO logic supply option available ESD protection on the bus pins IEC 61000-4-2 ±12 kV contact discharge IEC 61000-4-2 ≥ ±12 kV air discharge HBM: ≥ ±30 kV Full hot swap support (glitch free power-up/power-down) High speed 50 Mbps data rate (ADM3065E/ADM3066E/ADM3067E/ADM3068E) Low speed 500 kbps data rate for long cables (ADM3061E/ADM3062E/ADM3063E) Full receiver short-circuit, open circuit, and bus idle fail-safe Extended temperature range up to 125°C PROFIBUS compliant at VCC ≥ 4.5 V Half duplex and full duplex models available Allows connection of up to 128 transceivers onto the bus Space-saving package options 10-lead, 3 mm × 3 mm LFCSP 8-lead and 10-lead, 3 mm × 3 mm MSOP 8-lead and 14-lead, narrow body SOIC

Level 4 EMC Protected RS-485 Transceiver with Full 42 V Fault Protection Features: Certified Level 4 EMC protection on RS-485 A and B bus pins IEC 61000-4-5 surge protection (±4 kV) IEC 61000-4-4 EFT protection (±2 kV) IEC 61000-4-2 ESD protection ±8 kV contact discharge ±15 kV air gap discharge Certified IEC 61000-4-6 conducted RF immunity (10 V/m rms) RS-485 A and B bus pins HBM ESD >±30 kVADM3095E-EP supports defense and aerospace applications (AQEC standard) Download ADM3095E-EP Data Sheet (pdf) Military −55°C to +125°C operating temperature range Controlled manufacturing baseline 1 assembly/test site Enhanced product change notification Qualification data available on request V62/17618 DSCC Drawing Number

5 kV/3.75 kV rms, 600 Mbps Dual Channel LVDS Isolator Features: 5 kV rms/3.75 kV rms LVDS isolator Complies with TIA/EIA-644-A LVDS standard Multiple dual-channel configurations Up to 600 Mbps switching with low jitter 4.5 ns maximum propagation delay 151 ps maximum peak-to-peak total jitter at 600 Mbps 100 ps maximum pulse skew 600 ps maximum part to part skew 2.5 V or 3.3 V supplies −75 dBc power supply ripple rejection and glitch immunity ±8 kV IEC 61000-4-2 ESD protection across isolation barrier High common-mode transient immunity: >25 kV/μs Passes EN55022 Class B radiated emissions limits with 600 Mbps PRBS Safety and regulatory approvals (20-lead SOIC package) UL: 5000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE certificate of conformity DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 424 V peak Fail-safe output high for open, short, and terminated input conditions Operating temperature range: −40°C to +125°C Choice of package and isolation options 3.75 kV rms in highly integrated 20-lead SSOP 5 kV rms in 20-lead SOIC with 7.8 mm creepage/clearance

5 kV RMS/3.75 kV RMS, Dual LVDS Gigabit Isolator (Second Channel Reversed) Features: 5 kV rms and 3.75 kV rms LVDS isolators Complies with TIA/EIA-644-A LVDS standard Multiple dual-channel configurations Any data rate up to 1.1 Gbps switching with low jitter 4 ns typical propagation delay 2.6 ps rms typical random jitter, rms 90 ps typical peak-to-peak total jitter at 1.1 Gbps 2.5 V or 3.3 V supplies −75 dBc power supply ripple rejection, phase spur level Glitch immunity ±8 kV IEC 61000-4-2 ESD protection across isolation barrier High common-mode transient immunity: >25 kV/μs Passes EN 55022 Class B radiated emissions limits with 1.1 Gbps PRBS Safety and regulatory approvals (20-lead SOIC_W package) UL (pending): 5000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A (pending) VDE certificate of conformity (pending) DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 424 VPEAK Fail-safe output high for open, short, and terminated input conditions (ADN4655/ADN4656) Operating temperature range: −40°C to +125°C 7.8 mm minimum creepage and clearance

5 kV RMS/3.75 kV RMS, Dual LVDS Gigabit Isolator (First Channel Reversed) Features: 5 kV rms and 3.75 kV rms LVDS isolators Complies with TIA/EIA-644-A LVDS standard Multiple dual-channel configurations Any data rate up to 1.1 Gbps switching with low jitter 4 ns typical propagation delay 2.6 ps rms typical random jitter, rms 90 ps typical peak-to-peak total jitter at 1.1 Gbps 2.5 V or 3.3 V supplies −75 dBc power supply ripple rejection, phase spur level Glitch immunity ±8 kV IEC 61000-4-2 ESD protection across isolation barrier High common-mode transient immunity: >25 kV/μs Passes EN 55022 Class B radiated emissions limits with 1.1 Gbps PRBS Safety and regulatory approvals (20-lead SOIC_W package) UL (pending): 5000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A (pending) VDE certificate of conformity (pending) DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 424 VPEAK Fail-safe output high for open, short, and terminated input conditions (ADN4655/ADN4656) Operating temperature range: −40°C to +125°C 7.8 mm minimum creepage and clearance

3.3 V, 200 Mbps, Half-Duplex, High Speed M-LVDS Transceiver with Type 2 Receiver Features: Multipoint LVDS transceivers (low voltage differential signaling driver and receiver pairs) Switching rate: 200 Mbps (100 MHz) Supported bus loads: 30 to 55 Type 2 receiver type: threshold offset of 100 mV for open-circuit and bus-idle fail-safe Conforms to TIA/EIA-899 standard for M-LVDS Glitch free power-up/power-down on M-LVDS bus Controlled transition times on driver output Common-mode range: −1 V to +3.4 V, allowing communication with 2 V of ground noise Driver outputs high-Z when disabled or powered off See data sheet for additional features

Integrated Optical Module with Ambient Light Rejection and Two LEDs Features: 3.8 mm × 5.0 mm × 0.9 mm module with integrated optical components 2 green LEDs, 2 PDs with IR cut filter 2 external sensor inputs 3, 370 mA LED drivers 20-bit burst accumulator enabling 20 bits per sample period On-board sample to sample accumulator enabling up to 27 bits per data read Custom optical package made to work under a glass window Optimized SNR for signal limited cases I2C or SPI communications

Multimodal Sensor Front End Features: Multimodal analog front end 8 input channels with multiple operation modes for various sensor measurements Dual-channel processing with simultaneous sampling 12 programmable time slots for synchronized sensor measurements Flexible input multiplexing to support differential and single-ended sensor measurements 8 LED drivers, 4 of which can be driven simultaneously Flexible sampling rate from 0.004 Hz to 9 kHz using internal oscillators On-chip digital filtering SNR of transmit and receive signal chain: 100 dB AC ambient light rejection: 60 dB up to 1 kHz 400 mA total LED peak drive current Total system power dissipation: 30 µW (combined LED and AFE power), continuous PPG measurement at 75 dB SNR, 25 Hz ODR, 100 nA/mA CTR SPI communications supported 512-byte FIFO size

Multimodal Sensor Front End Features: Multimodal analog front end 8 input channels with multiple operation modes for various sensor measurements Dual-channel processing with simultaneous sampling 12 programmable time slots for synchronized sensor measurements Flexible input multiplexing to support differential and single-ended sensor measurements 8 LED drivers, 4 of which can be driven simultaneously Flexible sampling rate from 0.004 Hz to 9 kHz using internal oscillators On-chip digital filtering SNR of transmit and receive signal chain: 100 dB AC ambient light rejection: 60 dB up to 1 kHz 400 mA total LED peak drive current Total system power dissipation: 30 µW (combined LED and AFE power), continuous PPG measurement at 75 dB SNR, 25 Hz ODR, 100 nA/mA CTR SPI communications supported 512-byte FIFO size

0.5C Accurate, 16-Bit Digital SPI Temperature Sensor Features: Easy implementation No temperature calibration/correction required by user No linearity correction required Low power Power saving 1 sample per second (SPS) mode 700 µW typical at 3.3 V in normal mode 7 µW typical at 3.3 V in shutdown mode High performance Temperature accuracy ±0.5°C from −40°C to +105°C (2.7 V to 3.6 V) ±0.4°C from −40°C to +105°C (3.0 V) 16-bit temperature resolution: 0.0078°C Fast first temperature conversion on power-up of 6 ms See datasheet for additional features

0.5C Accurate, 16-Bit Digital I2C Temperature Sensor Features: High performance Temperature accuracy ±0.5°C from −40°C to +105°C (2.7 V to 3.6 V) ±0.4°C from −40°C to +105°C (3.0 V) 16-bit temperature resolution: 0.0078°C Fast first temperature conversion on power-up of 6 ms Easy implementation No temperature calibration/correction required by user No linearity correction required Low power Power saving 1 sample per second (SPS) mode 700 µW typical at 3.3 V in normal mode 7 µW typical at 3.3 V in shutdown mode Wide operating ranges Temperature range: −55°C to +150°C Voltage range: 2.7 V to 5.5 V Programmable interrupts Critical overtemperature interrupt Overtemperature/undertemperature interrupt I2C-compatible interface 8-lead narrow SOICRoHS-compliant package

1 MegaPixel Time-of-Flight Module Features: 1024 × 1024 ToF imager with 3.5 μm × 3.5 μm pixels 75 × 75 deg Field of view (FOV) Imager lens subassembly with 940nm bandpass filter Illumination subassembly with eye safety support 4-lane MIPI CSI-2 Tx interface, 1.5 Gbps per lane 4-wire SPI and 2-wire I2C serial interfaces NVM (Flash) for module boot-up sequence Power regulators for local imager and illumination rails Calibrated modes at 1024 × 1024 and 512 × 512 resolutions Depth range: 0.4m to 4m (depth noise 15mm max, 15% min reflectivity, <5 klux equivalent sunlight) Depth accuracy: ± 3 mm (across full depth range)

Precision Analog Microcontroller, 12-Bit Analog I/O, ARM7TDMI MCU with Enhanced IRQ Handler Features:Analog I/O Multichannel, 12-bit, 1 MSPS ADC Up to 12 ADC channels Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 4 DAC outputs available On-chip voltage reference On-chip temperature sensor Voltage comparatorMicrocontroller ARM7TDMI core, 16-bit/32-bit RISC architecture JTAG port supports code download and debugClocking options Trimmed on-chip oscillator (±3%) External watch crystal External clock source up to 44 MHz 41.78 MHz PLL with programmable divider Memory 62 kB Flash/EE memory, 8 kB SRAM In-circuit download, JTAG-based debug Software-triggered in-circuit reprogrammability Vectored interrupt controller for FIQ and IRQ 8 priority levels for each interrupt type Interrupt on edge or level external pin inputsOn-chip peripherals 2× fully I2C-compatible channels SPI (20 Mbps in master mode, 10 Mbps in slave mode) With 4-byte FIFO on input and output stages Up to 20 GPIO pins - Digital only GPIOs are 5 V tolerant 3× general-purpose timers Watchdog timer (WDT) Programmable logic array (PLA) 16 PLA elements 16-bit, 5-channel PWM

Integrated Precision Battery Sensor for Automotive Features:HIGH PRECISION ADCS Dual channel, simultaneous sampling, 16-bit, Σ-Δ ADCs Programmable ADC throughput from 1 Hz to 8 kHz On-chip 5 ppm/°C voltage reference Current channel Fully differential, buffered input Programmable gain from 1 to 512 ADC input range: −200 mV to +300 mV Digital comparators, with current accumulator feature Voltage channel Buffered, on-chip attenuator for 12 V battery inputs Temperature channel External and on-chip temperature sensor optionsMICROCONTROLLER ARM7TDMI® core, 16-/32-bit RISC architecture 20.48 MHz PLL with programmable divider PLL input source On-chip precision oscillator On-chip low power oscillator External (32.768 kHz) watch crystal JTAG port supports code download and debugMEMORY 96-kB Flash/EE memory, 6-kB SRAM 10,000-cycle Flash/EE endurance, 20-year Flash/EE retention In-circuit download via JTAG and LINON-CHIP PERIPHERALS SAEJ2602/LIN 1.3/LIN 2.0-compatible (slave) support via UART with hardware synchronization Flexible wake-up I/O pin, master/slave SPI® serial I/O 9-pin GPIO port, 3× general-purpose timers Wake-up and watchdog timers Power supply monitor, on-chip power-on-resetPOWER Operates directly from 12 V battery supply Current consumption Normal mode 10 mA at 10 MHz Low power monitor modePACKAGE AND TEMPERATURE RANGE 48-lead, 7 mm × 7 mm LFCSP Fully specified for −40°C to +115°C operation

MicroConverter, Dual 16-Bit/24-Bit - ADCs with Embedded 62 kB Flash MCU Features: High Resolution - ADCs 2 Independent ADCs (16-Bit and 24-Bit Resolution) 24-Bit No Missing Codes, Primary ADC 21-Bit rms (18.5-Bit p-p) Effective Resolution @ 20 Hz Offset Drift 10 nV/C, Gain Drift 0.5 ppm/C Memory 62 Kbytes On-Chip Flash/EE Program Memory 4 Kbytes On-Chip Flash/EE Data Memory Flash/EE, 100 Year Retention, 100 Kcycles Endurance 3 Levels of Flash/EE Program Memory Security In-Circuit Serial Download (No External Hardware) High Speed User Download (5 Seconds) 2304 Bytes On-Chip Data RAM 8051-Based Core 8051 Compatible Instruction Set 32 kHz External Crystal On-Chip Programmable PLL (12.58 MHz Max) 3  16-Bit Timer/Counter 26 Programmable I/O Lines 11 Interrupt Sources, Two Priority Levels Dual Data Pointer, Extended 11-Bit Stack Pointer See data sheet for additional features

Hot Swappable Dual I2C Isolator Features: Bidirectional I2C communication Open-drain interfaces Suitable for hot swap applications 30 mA current sink capability 1000 kHz operation 3.0 V to 5.5 V supply/logic levels 8-lead, RoHS compliant SOIC package See datasheet for additional features

Aerospace 150 MBPS Quad-Channel Digital Isolator Features: 400 Vrms Rated Dielectric Insulation Voltage in Aero package High common-mode transient immunity: >100 kV/μs 1.8 V to 5 V level translation Fail-safe high Low propagation delay 13.5 ns maximum for 5 V operation 15 ns maximum for 1.8 V operation Low power consumption 17 ma at 150 MBPS supply current side 1 17.5 ma at 150 MBPS supply current side 2 150 Mbps maximum guaranteed data rate

3.75 kV, 6-Channel, SPIsolator Digital Isolator for SPI with Delay Clock Features: Supports up to 40 MHz SPI clock speed in delay clock mode Supports up to 17 MHz SPI clock speed in 4-wire mode 4 high speed, low propagation delay, SPI signal isolation channels 2 data channels at 250 kbps Delayed compensation clock line 20-lead SSOP with 5.1 mm creepage High temperature operation: 125°C High common-mode transient immunity: >25 kV/μs Safety and regulatory approvals UL recognition per UL 1577 3750 V rms for 1 minute CSA Component Acceptance Notice 5A VDE certificate of conformity DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 565 V peak