Digital 2.5 W, 5.1 V, Boost Class-D Audio Amplifier with Output Sensing Features: Filterless Class-D amplifier with spread-spectrum Σ-Δ modulation with integrated boost regulator (5.1 V) Digitized output of output voltage, output current, and VBAT supply voltage Integrated boost regulator Multiple serial data formats PDM input/output TDM slave with support for up to 8 chips on a single bus I2S or left justified slave Multichip I2S with support for up to 4 chips on one I2S bus 8 kHz to 192 kHz PCM sample rates 2.048 to 6.14 MHz PDM input sample rates Configurable via I2C control, TDM control, or PDM patterns Standalone control modes 2.5 W into 4 Ω load and 1.42 W into 8 Ω load at 3.6 V supply with <1% total harmonic distortion plus noise (THD + N) Available in 19-ball, 1.74 mm × 2.1 mm, 0.4 mm pitch WLCSP 89.7% system efficiency into 8 Ω at 1 W, VBAT = 3.6 V Output noise: 21.7 μV rms, A-weighted THD + N: 0.025% at 1 kHz, 500 mW output power PSSR: 90 dB at 217 Hz, with dither input 72 dB signal-to-noise ratio (SNR) on output current sensing and 77 dB SNR on voltage sensing Quiescent power consumption: 19.8 mW Pop-and-click suppression Flexible battery monitoring AGC Short-circuit protection for boost and Class-D outputs and thermal protection with automatic recovery Smart power-down when PDM stop condition or no clock input detected DC blocking high-pass filter and static input DC protection for PDM input Selectable ultralow EMI emissions and low latency modes

Low Noise, High Sensitivity Optical Sensor with IR Cut Filter Features: Ultrahigh detectivity photodetector 90 fA/√Hz (typical) ultralow noise floor Signal-to-noise ratio (SNR) near shot noise limit 137 μA (typical) of supply current when active (EE = 0 μW/cm2) 1 μA (typical) of supply current in standby High speed, deep junction photodiode Nominal linear output current: 240 μA (typical) Flexible output configuration Excellent pulse response High ambient light rejection Space-saving, 3 mm × 4 mm LFCSP package

Low Noise, High Sensitivity Optical Sensor with Green Bandpass Filter Features: Ultrahigh detectivity photodetector 90 fA/√Hz (typical) ultralow noise floor Signal-to-noise ratio (SNR) near shot noise limit 137 μA (typical) of supply current when active (EE = 0 μW/cm2) 1 μA (typical) of supply current in standby High speed, deep junction photodiode Nominal linear output current: 240 μA (typical) Flexible output configuration Excellent pulse response High ambient light rejection Space-saving, 4 mm × 4 mm LFCSP package

SmartMesh IP Wireless 802.15.4e PCBA Module with Chip Antenna Features: 42mm × 24mm PCBA module with on-board chip antenna Integrates 2.4 GHz, IEEE 802.15.4e System-on-Chip, Complete with Embedded SmartMesh Networking Software >99.999% Network Reliability in the Most Challenging RF Environments Sub 50µA Routing Nodes Serves as either a Wireless Mote, EManager, or Access Point Mote in a SmartMesh IP network These products contain encryption. Import/export restrictions may apply.

Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management Features: EEMBC ULPMark™-CP score (3 V): 189 Ultra low power active and hibernate modes Active mode dynamic current: 41 μA/MHz (typical) Flexi mode: 400 μA (typical) Hibernate mode: 0.65 μA (typical) Shutdown mode: 50 nA (typical) Shutdown mode (fast wake-up): 0.20 μA (typical) ARM Cortex-M4F processor at 52 MHz with FPU, MPU, ITM with SWD interface Power management Single-supply operation (connected to VBAT pins): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 512 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 128 kB of configurable system SRAM with parity Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Protected key storage in flash, SHA-256-based keyed HMAC and key wrap and unwrap User code protection TRNG Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters 1 I2C and 2 UART peripheral interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 51 in WLCSP) 3 general-purpose timers with PWM support RGB timer for driving RGB LED RTC0 for time keeping RTC1 with SensorStrobe and time stamping Programmable beeper 27-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator, SYS_CLKIN for external clock, and integrated PLL 32 kHz clock: on-chip oscillator and low power crystal oscillator Clock fail detection for external crystals Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator

High Temperature, 16-Bit, 600 kSPS PulSAR ADC Features: Download AD7981-KGD Data Sheet. Available as Known Good Die and fully guaranteed to data sheet specifications. Extreme high temperature operation Specified temperature range −55°C to +210°C (10-lead FLATPACK) −55°C to +175°C (10-Lead MSOP) High performance Pseudo differential analog input range 0 V to VREF with VREF between 2.4 V and 5.1 V Throughput: 600 kSPS Zero latency architecture 16-bit resolution with no missing codes INL: ±2.5 LSB maximum, DNL: ±0.9 LSB maximum Dynamic range: 92 dB, VREF = 5 V SNR: 91 dB at fIN = 1 kHz, VREF = 5 V THD: −102 dB at fIN = 1 kHz, VREF = 5 V SINAD: 90.5 dB at fIN = 1 kHz, VREF = 5 V Low power dissipation Single-supply 2.5 V operation with 1.8 V to 5 V logic interface 2.25 mW typical at 600 kSPS (VDD only) 4.65 mW typical at 600 kSPS (total) 75 μW typical at 10 kSPS Proprietary serial interface SPI-/QSPI-/MICROWIRE-/DSP-compatible Daisy-chain multiple ADCs and busy indicator Small footprint 10-lead, 3 mm × 3 mm, monometallic wire bonding MSOP 110-lead, 0.255 inches × 0.255 inches, monometallic wire bonding FLATPACK

1 ppm, 20-Bit, 1 LSB INL, Voltage Output DAC Features: 1 ppm resolution 1 ppm INL 7.5 nV/√Hz noise spectral density 0.19 LSB long term linearity stability <0.05 ppm/°C temperature drift 1μs settling time 1.4 nV-sec glitch impulse Operating temperature range: −40°C to +125°C 20-Lead TSSOP package Wide power supply range up to ±16.5 V 35 MHz Schmitt triggered digital interface 1.8 V compatible digital interfaceAD5791-EP supports defense and aerospace applications (AQEC standard) Download the AD5791-EP Data Sheet (pdf) Military temperature range (−55°C to +125°C) Controlled manufacturing baseline One assembly/test site One fabrication site Enhanced product change notification Qualification data available on request V62/12664 DSCC Drawing Number

Ultra Low Power ARM Cortex-M3 MCU with Integrated Power Management and 256 KB of Embedded Flash Memory Features: EEMBC ULPMark™-CP score: 245.5 Ultra low power active and hibernate mode Active mode dynamic current: 30 μA/MHz (typical) Flexi mode: 300 μA (typical) Hibernate mode: 750 nA (typical) Shutdown mode: 60 nA (typical) ARM Cortex-M3 processor with MPU Up to 26 MHz with serial wire debug interface Power management Single-supply operation (VBAT): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 128 kB/256 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 64 kB of configurable system SRAM with parity up to 32 kB of SRAM retained in hibernate mode Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security TRNG User code protection Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters I2C and UART interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 34 in WLCSP) 3 general-purpose timers with PWM support RTC and FLEX_RTC with SensorStrobe and time stamping Programmable beeper 25-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator 32 kHz clock: on-chip oscillator, low power crystal oscillator Integrated PLL with programmable divider Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator 

Up to 1GHz SHARC+ DSP with 640KB L1, 1024KB Shared L2 SRAM, 400-Ball CSP_BGA Features:SHARC+ Core infrastructure 800MHz (max) or 1GHz (max) Core clock frequency 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedMemory 1024KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases One Level 3 (L3) interface optimized for low system power, providing 16-bit interface to DDR3 (supporting 1.35 V capable DDR3L devices) SDRAM devices16-bit DDR/DDR3L Memory Controller 1.35V support for DDR3LAdvanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 4x Precision Clock Generators 28 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin 6x I2C,3x UARTs 2x Link Ports 10x General Purpose Timer, 1x General Purpose Counter 2x Watchdog Timers 4-ch 12bit Housekeeping ADCs 40 GPIO pins, 28 DAI pins Thermal SensorPackage 17mm x 17mm (0.8mm pitch) 400-ball CSP_BGAAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

0.25C Accurate, 16-Bit Digital I2C Temperature Sensor Features: High performance Temperature accuracy ±0.20°C from −10°C to +85°C at 3.0 V ±0.25°C from −20°C to +105°C from 2.7 V to 3.3 V 16-bit resolution: 0.0078°C Ultralow temperature drift: 0.0073°C NIST traceable or equivalent Fast first temperature conversion on power-up of 6 ms Easy implementation No temperature calibration/correction required by user No linearity correction required Low power Power-saving 1 sample per second (SPS) mode 700 µW typical at 3.3 V in normal mode 7 µW typical at 3.3 V in shutdown mode Wide operating ranges Temperature range: −40°C to +150°C Voltage range: 2.7 V to 5.5 V Programmable interrupts Critical overtemperature interrupt Overtemperature/undertemperature interrupt I2C-compatible interface 16-lead, 4 mm × 4 mm LFCSP RoHS-compliant package

Real-Time Ethernet Multiprotocol (REM) Switch Features: 144-lead CSP_BGA RoHS compliant package −40°C to +105°C industrial temperature range rating 3.3 V input/output buffers IEEE 802.3, 10 Mbps/100 Mbps, half and full duplex, IPv6 and IPv4 communication 2 independent Ethernet ports: 1 MII and 1 RMII interface per port Support for all industrial protocols PROFINET Class B and Class C with fast startup (Version 2.3) EtherNet/IP with QuickConnect, CIP Sync, and CIP Motion Modbus TCP EtherCAT Ethernet POWERLINK Host interface transfer rate: 32 bits per 28 ns Supports EtherCAT cycle times down to 12.5 μs and PROFINET cycle times down to 31.25 μs PI Net Load Class III capable DLR (supervisor and node, announce and beacon based), MRPD, HSR, PRP, shared device, controller redundancy IEEE 1588Version 2 support: ordinary clock; both peerto peer and end to end transparent clocks, raw frames, and UDP 8 independent timer signals synchronized with an internal precision timer 4 independently programmable timer signals for timer capture events or timer output events 4 timer signals create programmable periodic waveforms synchronized to the internal precision timer DCP, LLDP, DHCP, RSTP, VLAN, IGMP snooping support Forwarding table with aging and learning Drive LEDs for link activity

Real-Time Ethernet Multiprotocol (REM) Switch Features: 144-lead CSP_BGA RoHS compliant package −40°C to +105°C industrial temperature range rating 3.3 V input/output buffers IEEE 802.3, 10 Mbps/100 Mbps, half and full duplex, IPv6 and IPv4 communication 2 independent Ethernet ports: 1 MII and 1 RMII interface per port Support for all industrial protocols PROFINET Class B and Class C with fast startup (Version 2.3) EtherNet/IP with QuickConnect, CIP Sync, and CIP Motion Modbus TCP EtherCAT Ethernet POWERLINK Host interface transfer rate: 32 bits per 28 ns Supports EtherCAT cycle times down to 12.5 μs and PROFINET cycle times down to 31.25 μs PI Net Load Class III capable DLR (supervisor and node, announce and beacon based), MRPD, HSR, PRP, shared device, controller redundancy IEEE 1588Version 2 support: ordinary clock; both peerto peer and end to end transparent clocks, raw frames, and UDP 8 independent timer signals synchronized with an internal precision timer 4 independently programmable timer signals for timer capture events or timer output events 4 timer signals create programmable periodic waveforms synchronized to the internal precision timer DCP, LLDP, DHCP, RSTP, VLAN, IGMP snooping support Forwarding table with aging and learning Drive LEDs for link activity

Real-Time Ethernet Multiprotocol (REM) Switch Features: 144-lead CSP_BGA RoHS compliant package −40°C to +105°C industrial temperature range rating 3.3 V input/output buffers IEEE 802.3, 10 Mbps/100 Mbps, half and full duplex, IPv6 and IPv4 communication 2 independent Ethernet ports: 1 MII and 1 RMII interface per port Support for all industrial protocols PROFINET Class B and Class C with fast startup (Version 2.3) EtherNet/IP with QuickConnect, CIP Sync, and CIP Motion Modbus TCP EtherCAT Ethernet POWERLINK Host interface transfer rate: 32 bits per 28 ns Supports EtherCAT cycle times down to 12.5 μs and PROFINET cycle times down to 31.25 μs PI Net Load Class III capable DLR (supervisor and node, announce and beacon based), MRPD, HSR, PRP, shared device, controller redundancy IEEE 1588Version 2 support: ordinary clock; both peerto peer and end to end transparent clocks, raw frames, and UDP 8 independent timer signals synchronized with an internal precision timer 4 independently programmable timer signals for timer capture events or timer output events 4 timer signals create programmable periodic waveforms synchronized to the internal precision timer DCP, LLDP, DHCP, RSTP, VLAN, IGMP snooping support Forwarding table with aging and learning Drive LEDs for link activity

DC to 18 GHz, Ultra Wideband, Dual Rank, 4 GSPS Track-and-Hold Amplifier Features: 18 GHz input sampling bandwidth (1 V p-p full-scale) 4 GSPS maximum sampling rate 67 dB SFDR at 4 GHz and 0.5 V p-p input and CLK = 1 GSPS) 56 dB SFDR at 4 GHz and 1 V p-p input and CLK = 1 GSPS) Direct coupled input/output Ultra clean output waveforms, minimal glitching ≥65 dB hold mode feedthrough rejection 1.45 per specs mV rms hold mode output noise 32-terminal ceramic leadless chip carrier, 5 mm × 5 mm

5.5 GHz to 18 GHz, GaAs, pHEMT, MMIC, Medium Power Amplifier Features: High saturated output power: 26 dBm with 24% PAE  High gain: 24 dB typical High output IP3: 36 dBm typical High output P1dB: 25.5 dBm Die size: 2.19 mm × 1.05 × 0.1 mm

5.5 GHz to 18 GHz, GaAs, pHEMT, MMIC, Medium Power Amplifier Features: High saturated output power: 26 dBm with 24% PAE  High gain: 24 dB typical High output IP3: 36 dBm typical High output P1dB: 25.5 dBm Die size: 2.19 mm × 1.05 × 0.1 mm

Wideband Direct Quadrature Modulator, 100 - 6000 MHz Features: Very Low Noise Floor, -160 dBm/Hz Excellent Carrier & Sideband Suppression Very High Linearity, +30 dBm OIP3 High Output Power, +11 dBm Output P1dB High Modulation Accuracy 24 Lead 4x4 mm QFN Package: 16 mm2

10.38 GHz to 11.30 GHz MMIC VCO with Half Frequency Output Features: Dual output frequency range fOUT = 10.38 GHz to 11.30 GHz fOUT/2 = 5.19 GHz to 5.65 GHz 32-lead, RoHS compliant, 5 mm × 5 mm LFCSP (25 mm2) Single-side band (SSB) phase noise −86 dBc/Hz typical at 10 kHz −114 dBc/Hz typical at 100 kHz No external resonator needed Power output (POUT): 8 dBm

Wideband Direct Quadrature Modulator w/ Fractional-N PLL & VCO, 100 - 4000 MHz Features: Very Low Noise Floor, -160 dBm/Hz Excellent Carrier & Sideband Suppression Very High Linearity, +30 dBm OIP3 High Output Power, +10.5 dBm Output P1dB High Modulation Accuracy Maximum Phase Detector Rate: 100 MHz Low Phase Noise: -110 dBc/Hz in Band Typical See datasheet for additional features

GaAs, Nonreflective, SP4T Switch 100 MHz to 4 GHz Features: Broadband frequency range: 100 MHz to 4 GHz Nonreflective 50 Ω design Low insertion loss: 0.7 dB at 2 GHz High isolation: 43 dB at 2 GHz High input linearity at 250 MHz to 4 GHz 1 dB compression (P1dB): 29 dBm typical Third order intercept (IP3): 47 dBm typical High power handling 28.5 dBm through path 25 dBm terminated path Single positive supply: 3 V to 5 V Integrated 2 to 4 line decoder 16-lead, 3 mm × 3 mm LFCSP package ESD rating: 250 V (Class 1A) Pin compatible with the HMC7992 HMC241ALP3E supports defense and aerospace applications (AQEC standard) Download the HMC241ATCPZ-EP data sheet Military temperature range (−55°C to +125°C) Controlled manufacturing baseline One assembly/test site Product change notification Qualification data available on request