56-Pin Quad Flatpack No-Lead Logic Package

Texas Instruments (TI) Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220 allows for board miniaturization and holds several advantages over traditional SOIC TQFP TSSOP and TVSOP packaging. This package designated RGQ by TI physically is smaller than traditional leaded solutions has a smaller routing area improved thermal performance and improved electric