Using TI Tag-it™ HF-I Transponder Technology for NFC Vicinity Applications (Rev. A)
Texas InstrumentsTexas Instruments’ Tag-it™ HF-I family of transponders and silicon (inlays, encapsulated devices, and wafers) consist of 13.56-MHz high-frequency (HF) devices that are compliant with the ISO/IEC15693 and ISO/IEC18000-3 (Mode 1) global open standards.
The NFC Forum has specified the NFC data exchange format (NDEF) for using tag memory to store text, a uniform resource identifier (URI), or images (portable network graphics (PNG) or joint photographic experts group (JPEG) file types). This application report is intended to guide users and developers who are interested in also using them for NFC vicinity applications.
The Tag-it HF-I transponder inlay and silicon wafer offerings are well suited for a variety of applications including but not limited to: product authentication, library applications, supply chain management, asset management, and ticketing/stored value applications.
Texas Instruments TRF796x and TRF797x family of RFID/NFC reader/writer ICs coupled with any of the broad portfolio of Texas Instruments microcontrollers (that is, MSP430™, C2000™, Stellaris®, Sitara™, DaVinci™, or OMAP™) can be used with the above mentioned transponders, inlays, or transponder ICs to create complete RFID/NFC system.
High Efficiency Class 4 PoE Powered Device
Texas InstrumentsThis report introduces a high-efficiency Power-over-Ethernet (PoE) Powered Device (PD) that complies with the Type 2 Class 4 power requirements outlined in the IEEE802.3at Draft 3.3 standard. The standard permits a Type 2 Class 4 PD to draw up to 25.5 W of power at the Power Interface (PI) when connected to compatible Type 2 Power Sourcing Equipment (PSE) using Type 2 compliant cabling. A fully
DN102 -- SoC Temperature Sensor (Rev. A)
Texas InstrumentsThis design note includes descriptions and a code example for easily measuring the temperature of a device by using the internal temperature sensor connected to the ADC. The code is suitable for the CC1110 CC1111 CC2430 CC2431 CC2510 and CC2511 system on chip (SOC) devices.
ARM Compiler Tips and Code Size Optimization Using DSP/BIOS Link
Texas InstrumentsARM Compiler Tips and Code Size Optimization Using DSP/BIOS Link Application Report
High Efficiency Dual Chemistry Charger Using the bq2000
Texas InstrumentsIn this example the bq2000 is used to design a simple and cost-effective chemistry-independent charger. This implementation is suitable for any application requiring a high efficiency charge management in a small footprint.
Digital FIR Filter Design Using the MSP430F169
Texas InstrumentsDigital FIR Filter Design Using the MSP430F169
AN-1166 Using the LMX5001 Bluetooth Link Controller
Texas InstrumentsApplication Note 1166 Using the LMX5001 Bluetooth Link Controller
Enhanced HCILL: Four-Wire Power Management Protocol (Rev. B)
Texas InstrumentsEnhanced HCILL Four-Wire Power Management Protocol
LVC Characterization Information
Texas InstrumentsThis document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices.
Using I2C Communication With the bq275xx Series of Fuel Gauges (Rev. B)
Texas InstrumentsUsing I2C Communication With the bq275xx Series of Fuel Gauges
Interfacing the TLV1571/78 Analog-to-Digital Converter to the TMS320C542 DSP
Texas InstrumentsThis application report presents a hardware solution for interfacing the TLV1571/TLV1578 10-bit 1.25 MSPS low-power analog-to-digital converter (ADC) to the 16-bit fixed-point TMS320C542 digital signal processor (DSP). The report describes the interface hardware and C-callable software routines which support communication between ADC and DSP.
Using C to Access Data Stored in Program Memory on the TMS320C54x DSP (Rev. A)
Texas InstrumentsEfficient utilization of available memory in a TMS320C54x DSP sometimes requires the placement of data in program space memory (as opposed to data space memory). However accessing this data using the C programming language is problematic since the C-compiler provides no mechanism for accessing program space. This application note presents a solution for accessing data stored in program space mem
PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II
Texas InstrumentsOnce the main printed circuit board (PCB) has been designed, the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP a
Interfacing LDC1000 with the MSP430 LaunchPad
Texas InstrumentsThe LDC1000 is a programmable inductance-to-digital converter for use in inductance-sensingapplications. It offers a complete signal path solution between an LC tank and a microcontroller byproviding proximity and inductance data. The MSP430 is an ideal microcontroller solution for low-costlow-power precision sensor applications because it consumes very little power. This library provides
Installing TSC2301 WinCE Generic Drivers on an XScale Platform
Texas InstrumentsProper installation is required to use the TI TSC2301 WinCE generic drivers with a given host processor. This includes copying the drivers into the corresponding directories and tailoring the processor-dependent layer (PDL) files for the drivers to the hardware specifications of the processor. This application report presents an example driver installation on an Intel? XScale? PXA250 Lubbock platf
Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
Texas InstrumentsPlastic Ball Grid Array [PBGA] Application Note
DTMF-Controlled Remote Switching Application Using the MSP430
Texas InstrumentsThis reference design demonstrates how the MSP430 ultra-low power, mixed signal processor can be used to perform the real-time signal processing necessary to implement a dual tone multi-frequency (DTM
Effect of Parasitic Capacitance in Op Amp Circuits (Rev. A)
Texas InstrumentsParasitic capacitors are formed during normal op amp circuit construction. Op amp design guidelines usually specify connecting a small 20-pF to 100-pF capacitor between the output and negative input and isolating capacitive loads with a small 20-ohm to 100-ohm resistor. This application report analyzes the effects of capacitance at the input and output pins of an op amp and suggests means for
OA-25 Stability Analysis of Current Feedback Amplifiers (Rev. C)
Texas InstrumentsHigh frequency current-feedback amplifiers (CFA) are finding a wide acceptance in more complicatedapplications from dc to high bandwidths. Often the applications involve amplifying signals in simpleresistive networks for which the device-specific data sheets provide adequate information to complete thetask. Too often the CFA application involves amplifying signals that have a complex load or
