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Application Notes

PV Inverter Design Using Solar Explorer Kit (Rev. A)

Texas Instruments
This application report goes over the solar explorer kit hardware and explains control design of Photo Voltaic (PV) inverter using the kit.

Tiva? C Series Application Update Using the USB DFU Class

Texas Instruments
This application report provides a brief overview of the Device Firmware Upgrade (DFU) class, describes the Tiva implementation in the USB boot loader (boot_usb) application, and also describes the ho

TMS320C62x/67x Power Supply Solutions for 1-2 DSPs Using the TL5001A and TPS7133 (Rev. A)

Texas Instruments
This application report describes a low-cost power solution for Texas Instruments' TMS320C6000 DSP applications using the TL5001PWM controller and the TPS7133 low drop-out voltage regulator. The reference design included in this report uses the TL5001AEVM-122 (SLVP122) evaluation module (EVM) which is available for customer testing and evaluation.

FIFO Mailbox-Bypass Registers: Using Bypass Registers to Initialize DMA Control (Rev. A)

Texas Instruments
The TI 32- and 36-bit FIFOs contain mailbox-bypass registers that transmit priority from one FIFO port to the other port A to B or port B to A with out storing the data in the FIFO SRAM buffer. This document describes the FIFO mailbox-bypass registers and shows an example of direct memory access (DMA) control of a digital signal processor (DSP). The components described are the SN74ACT3641 and th

DSP/BIOS II Timing Benchmarks on the TMS320C6000 DSP

Texas Instruments
This document describes each of the DSP/BIOS II performance benchmarks and the accompanying results followed by a technique used for calculating overall system performance or overhead. To help designers better analyze their system performance we have detailed the methodology used for obtaining each of the benchmarks along with the number of CPU cycles to execute each of the DSP/BIOS II functions

Interfacing Quadrature Encoders Using the High-End Timer on Hercules MCUs

Texas Instruments
The next-generation high-end timer module (HET) on Hercules MCUs is an intelligent timer that provides sophisticated timing functions for real-time applications. The timer is an independent coprocessor using its own reduced instruction set with a specialized timer micromachine and an attached I/O port. The HET can be used for generating pulse-width-modulated outputs for capturing or comparing i

High Integration, High Efficiency Power Solution using DCDC Converters for DM365 (Rev. A)

Texas Instruments
TMS320DM365, TPS65053 High Integration, High Efficiency Power Solution using DCDC Converters for DM365

DC Offset Auto-Calibration of TRF371x

Texas Instruments
The TRF371x family provides an automatic calibration circuit to minimize the DC offset imbalance in the baseband outputs. This eliminates the dc signal at the ADC output which eats into the valuable dynamic range of the ADC device. This report breaks down the operation of the dc offset calibration and provides the recommended register settings for optimum performance. The convergence time of the c

ECC/EDC on TDAxx

Texas Instruments

TDA2x and TDA3x series of automotive processor are designed to be used in automotive safety systems. To enable safety, these processors come with error detection and correction (EDC) support for vario

Class-D Amplifier External Load Diagnostics

Texas Instruments
This application report provides design information for an external load diagnostics circuit to detect andidentify electrical faults between the output of an audio amplifier and a target speaker. While theTPA3111D1-Q1 class-D amplifier is used as an example in this application note this design methodologyis relevant for most class-D amplifiers to provide external fault diagnostics.

Vibration and Shock Sensitivity: A Comparative Study of Oscillators

Texas Instruments
When designing a system that incorporates a clock oscillator the vibration sensitivity of the oscillatordevice is a specification that is easily overlooked. Sensitivity to vibration can have a detrimental impact onthe overall system performance. Since crystal oscillators fundamentally rely on the vibration andmechanical resonance of a piezoelectric material external disturbances can couple

IWR1642 Bootloader Flow

Texas Instruments
This application report describes the IWR1642 bootloader flow.

Capacitive technology in wearable devices

Infineon Technologies AG

Low-power, high-accuracy pressure sensing for battery operated wearable devices

With more and more applications requiring high-accuracy atmospheric pressure data, engineers are seeking ever-more sensitive pressure sensing methods. New sensor technologies that are based on capacitive sensing enable engineers to create miniaturized and very accurate devices while satisfying demanding energy constraints and addressing reliability challenges.

Fitness monitoring wearables are a large part of a growing variety of products and applications require the high-accuracy sensing of static and dynamic air pressure. As these applications are typically found in batteryoperated devices, it is also essential to combine the high accuracy with optimized low-power operation and reliability across a broad range of operating conditions.

Many existing small form-factor MEMS (Micro Electro-Mechanical System) pressure sensors are built around piezo-resistive measurement techniques. In these cases, the flexing of a diaphragm in relation to changes in pressure is sensed via a strain sensor. However, piezo-resistive sensing elements are particularly susceptible to variation with temperature changes and they do not respond linearly to temperature. For this reason, piezoresistive sensors have a need for more complex calibration compared to a capacitive element. In addition, resistive measurement can represent a significant drain on power – a particularly important consideration when the target application is battery-powered and operating lifetime is critical.

By Sampo Härkönen, Senior Manager Pressure Sensor Marketing, Infineon Technologies

Download and read the full whitepaper below.

MSP430FR6047 and Ultrasonic Software Based Water Flow Meter Measurement Results

Texas Instruments
This document summarizes the results of the measurements with the RevA MSP430FR6047 device with the ultrasonic software library for water flow meter.

LDO PSRR Measurement Simplified (Rev. A)

Texas Instruments
This applicationreportexplainsdifferentmethodsof measuringthe PowerSupplyRejectionRatio(PSRR)of a Low-Dropout(LDO)regulatorand includesthe prosand consof thesemeasuringmethods

HiFi Audio Circuit Design

Texas Instruments
With the increase in personal electronic devices HiFi audio is more popular than ever in many applications such as smartphones music players home theaters and even car infotainment. Many engineers and consumers devote themselves to the endless journey in HiFi audio. This document will help engineers understand judge design and optimize a HiFi audio circuit.

PGA460-Q1 in Automotive Ultrasonic Kick-to-open Liftgate Systems (Rev. A)

Texas Instruments

Also known as a Smart Trunk Opener (STO), the kick-to-open trunk application has grown significantly over recent years, especially in SUVs and high-end passenger vehicles. This feature allows the vehicle owner hands-free access to open the trunk with a simple kicking motion near the rear bumper.

Simplify Voltage and Current Measurement in Battery Test Equipment

Texas Instruments

Battery test equipment is used to verify battery pack functionality and performance prior to shipment to the customer. This Tech Note outlines three major functional tests that a battery tester performs while showing how to achieve the desired level of regulated error.

PGA460 Full-Bridge Driver Solutions for Ultrasonic Transducers

Texas Instruments

This document offers various implementations to achieve a full-bridge driver to excite an ultrasonic transducer when using the PGA460. Because the PGA460 was only designed to excite transducers in the transformer-driven or half-bridge driver modes, external circuitry is required to enable a full-bridge driver. The recommended solution is based on combining the functionality of the PGA460 with the DRV8870 to enable the excitation voltage to swing between ±45 V. Low-cost discrete alternatives are also discussed.

Ethernet PHY Configuration Using MDIO for Industrial Applications

Texas Instruments

As a bridge of the link layer device medium access controller (MAC) and physical medium such as copper cable, the Ethernet physical layer device (PHY) integrates all the physical-layer functions needed to transmit and receive data on standard twisted-pair cables. Proper PHY configuration using management data input/output (MDIO) is fundamental during the prototype stage, and also crucial to meeting the requirements of lowest deterministic latency and fastest link detection in industrial Ethernet applications such as EtherCAT. This application report provides guidance on the Ethernet PHY configuration using the MDIO module within the Programmable-Realtime Unit Industrial Communications Sub-System (PRUICSS) in the Sitara device from TI, for industrial applications, by dissecting the PHY DP83822 configuration in EtherCAT on the AMIC110 Industrial Communications Engine (ICE). The goal of this application report is to expedite the development of industrial Ethernet applications on custom boards with migration and troubleshooting guides for the PHYs.

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