This document contains implementation instructions for the two serializer/deserializer-based interfaces (SerDes) on the TMS320TCI6484 and TMS320C6457 DSP devices: <ul> <li>Serial RapidIO® (SRIO)
The Texas Instruments (TI) PowerFLEX family of voltage regulators offers surface-mount packages with high thermal-dissipation capability that can be mounted using standard techniques and equipment. This application report addresses power dissipation characteristics footprint sizes and land patterns; provides mechanical dimensions and tape-and-reel packing information; and illustrates solder-join
This application note presents several reference designs that implement the LM274X synchronous buckcontroller. The designs address various applications in a wide variety of configurations. The designreference will give an engineer a head start on their project with designs encompassing sequencingtracking synchronizing multiple power supplies DDR termination buck-boost low PCB real esta
In a real-time system data flow is important to understand and control to achieve high performance. By analyzing the timing characteristics for accessing data and switching between data requestors it is possible to maximize the achievable bandwidth in any system. This application note provides relevant information for TMS320C62x devices (such as the C6201(B) C6202(B) C6203 C6204 C6205 and C
Memory modules have long been a system designer's trump card. Modules, in addition to the traditional space savings, allow ease of implementation, known operating performance, flexible density options
In some cases such as wireless communications applications a system requires two communication channels but only one serial port is available. This document shows how to multiplex this port and how to interface two analog lines. There is a schematic and an example of code is given. The analog interface circuits (AICs) chosen for this solution were purposely selected to address as many potential
This application report presents the process of interfacing of the TLV320AIC12/13/14/15 voice-band codec with the TMS320C5402? DSP. It presents the hardware configuration and the software driver for a two-device cascade (single master and single slave) configuration mode. The design can be considered as an application example a test tool or a startup platform for developing and using the codec
Customers have evaluated several TI power-management (PMU) devices and have found that somedesigns can make the PMUs operate beyond typical data-sheet application specifications. This reportreviews the backgrounds of various relevant design features of a family of 5-V CMOS sub-PMUssuggests solutions to accommodate system requirements mitigates radiation concerns and proposesbest practic
The TPS61140/1 is a dual output boost converter providing regulated voltage and current output with one boost converter. The reference design and application example shown in this document can be used
This document describes the design considerations required to change a bq2084 design to a bq2084-V133 solution. Find the latest ordering information and data sheet on the World Wide Web at http://powe
This document describes issues of interest related to migration from the TMS320VC5410 to the TMS320VC5410A. The objective of this document is to indicate differences between the two devices. Functions that are identical between the two devices are not included. For detailed information on the specific functions of either device refer to the device data sheets 5410 (SPRS075) 5410A (SPRS139) the
This gold(Au) embrittlement study evaluates TI?s original four-layer nickel-palladium(NiPd) lead finish that was introduced in 1989 and TI?s nickel-palladium-gold(NiPdAu) lead finish that replaced four-layer NiPd in 2001. Samples were prepared with three different Au thicknesses for the NiPdAu components. The printed wiring board(PWB) finishes used were organic solderability preservative(OSP) and
Power consumption on an Ethernet PHY is affected by different operating conditions. System design around Ethernet products requires accurate power consumption numbers for component selection thermal management and power distribution planning. This application report details power consumption of DP83867 in different conditions.
This application report describes how to interface an MSP430 mixed-signal microcontroller with the TLC549 and TLV1549 3-volt A/D converters. This report is written for the MSP430x11x(1) family, but ca
This application report contains complete code examples for routines that have been developed using a TMS320C54x? EVM platform. These programs demonstrate applications that use a host interface and run in real time.