Description

The thermal management of printed-circuit boards is complex but must be well understood to achieve optimum performance and reliability. SWIFT(TM) dc/dc converters in the 28-pin HTSSOP package rely on an exposed lead frame die pad [PowerPAD(TM)] on the bottom of the package to provide an extremely low thermal resistance from junction to case. The thermal performance of the 6- 9- and 14-A SWIFT d