Description

A nickel/palladium (Ni/Pd) lead finish for integrated circuits (IC) was introduced in 1989. In 1998 solderability test results were published on Ni/Pd-finished components using a Sn/Ag/Cu/Sb lead-free (Pb-free) solder paste and printed wiring board (PWB) pads coated with organic solderability preservative (OSP). Since then a number of other Pb-free solder alloys have been introduced.This evalu