AN-1412 Micro SMDxt Wafer Level Chip Scale Package (Rev. K)

Texas Instruments

Published Date: 04/23/2013


Micro SMDxt is a wafer level CSP (WLCSP) with the following features:

  • Package size equal to die size
  • Smallest footprint per I/O count
  • No need for underfill material
  • Interconnect layout available in 0.4 mm or 0.5 mm pitch
  • No interposer between the silicon IC and the printed circuit board


Part Number Name Companion Part