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Application Notes from Texas Instruments

Single Versus Three Hall Sensor Configuration

Texas Instruments
This document provides an overview of the single and three sensor mode supported by the DRV10970.This document provides an overview of the single and three sensor mode supported by the DRV10970.

Built-In System Protection for Industrial Drives

Texas Instruments
Eight windowed comparators are integrated into the Delfino F2837xD MCU architecture providing “trip points” and operate independently from the CPU so there is no additional CPU loading. The comparators are also fast acting (50 ns reaction to trip!) and CPU independent to minimize latency with trip signals so the system can react quickly to any abnormal events or over/under limit conditions. The

Optimizing the TPS62097 Output Filter

Texas Instruments
Optimizing the TPS62097 Output Filter TPS62097

Power Estimation and Pwr Consumption Sum for TMS320C5504/05/14/15/32/33/34/35/45 (Rev. A)

Texas Instruments
This application report assists in estimating the power consumption for the TMS320C5515 C5504 C5505 C5514 C5532 C5533 C5534 C5535 and C5545 devices (DSPs) using a power estimation spreadsheet.

TPS25810 Charging Port Over USB Type-C

Texas Instruments

The TPS25810 is a USB Type-C downstream facing port (DFP) controller that monitors the USB Type-C configuration channel (CC) lines to determine when a USB device is attached. When the upstream facing port (UFP) device Type C-to-B dongle is plugged in, the port supports connection of Type-B receptacle devices such as a mouse, smartphones, keyboards, external hard drives, and so forth. As these devices monitor the USB 2 data line (D+/D–), the TPS2544 USB charging port controller can be added to provide the electrical signatures on D+/D– to support BC1.2 and non-BC1.2 compliant charging schemes. This application note presents the design solution which offers fast charging of popular mobile phones, tablets, and media devices over the USB Type-C port.

Setting LDC1312/4, LDC1612/4, and LDC1101 Sensor Drive Configuration

Texas Instruments
Setting LDC1312/4, LDC1612/4, and LDC1101 Sensor Drive Configuration

Receiver Skew Margin for Channel Link I and FPD Link I Devices

Texas Instruments
Receiver Skew Margin for Channel Link I and FPD Link I Devices

Correcting the Low-Frequency Response of the ADS42LBxx, ADS42JBxx for Time-Domai

Texas Instruments
In this application report, simple schemes are described to correct the low-frequency response of ADS42LBxx, ADS42JBxx family of analog-to-digital converters (ADCs). The described schemes are useful f

Method of Graphing Safe Operating Area (SOA) Curves in DC-DC Converter

Texas Instruments
Method of Graphing Safe Operating Area (SOA) Curves in DC-DC Converter TPS546C23

Reduce Electrical Stresses in a PFC stage during an AC drop test with UCD3138

Texas Instruments
Reduce Electrical Stresses in a PFC stage during an AC drop test with UCD3138

Support Selfie Sticks Using a TS3A227E Audio Jack Switch

Texas Instruments
Support Selfie Sticks Using a TS3A227E Audio Jack Switch TS3A227E

DLP System Optics Application Note

Texas Instruments
DLP® System Optics Application Note

Generic Wrist Watch Programmer's Guide (Rev. A)

Texas Instruments
Generic Wrist Watch Programmer's Guide /Microcontrollers/MSP/App_Reports/SLAA671

Generation of a VCOM buffer input using PWM signal

Texas Instruments
In an LCD the backlight shines through the liquid crystal material and the voltage across the liquid crystal controls how much light shines through it. An active matrix LCD (AMLCD) contains many pixels arranged in a grid pattern. The voltage across each pixel is controlled individually so that high resolution images can be created. One terminal of every pixel is connected to a common plane. The v

Power Consumption Analysis for Low Power Capacitive Sensing Applications

Texas Instruments
Power Consumption Analysis for Low Power Capacitive Sensing Applications

Five Steps to a Good PCB Layout of the Boost Converter

Texas Instruments

A good PCB layout is critical for the boost converter. The reason is that the boost converter is sensitive to parasitic capacitance and inductance because of the switch-mode operation. The bad PCB layout would introduce large parasitic capacitance and inductance, which would cause high output ripple, poor output voltage regulation and current limit accuracy, electromagnetic interference (EMI) problem, and even failure by the high voltage spike. Proper PCB layout will help to avoid most of these problems of the boost converter without extra cost if thought is spent before the first PCB is built.

Copying the layout of the boost converter from its datasheet or evaluation module (EVM) is easiest, but the layout may not fit the system board. So this application note details five steps that help to design a good PCB layout for the TPS61xxx converter.

TI DLP® Pico™ System Design: Brightness Requirements and Tradeoffs

Texas Instruments

The objective of this application note is to help product developers who are new to DLP Pico technology understand brightness and the related system tradeoffs.

HiRel Hermetic Product Package Material Content (Rev. A)

Texas Instruments
HiRel Hermetic Product Package Material Content

DRV3201 Current Sense Amplifier

Texas Instruments
DRV3201 Current Sense Amplifier

Routing the Middle Pins of the LP5562

Texas Instruments
The LP5562 is available in 12-bump DSBGA package with 0.4-mm pitch. This can be a limitation in costsensitive applications as routing out the middle bumps separately requires HDI PCB technology whichadds cost to the PCB manufacturing process.

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