TPS63020Q Pin FMEA TPS63020Q

This application report describes the electrical connections between the Texas Instruments TSB12LV01B and TSB41AB3 for common modes of operation. Use this document in conjunction with the TI application report Recommendations for PHY Layout (SLLA020) to successfully design a 1394 system.The TSB12LV01B is a high-performance general-purpose IEEE 1394-1995 link-layer controller (LLC) with the

This application report describes the ADS1252?s input circuit to better illustrate the loading seen by the signal source.

The bq2010 Gas-Gauge IC is a complete battery-monitoring product for NiMH and NiCd batteries. This tutorial introduces the bq2010. The tutorial should be used with the bq2010 data sheet when designing with or evaluating the bq2010. It describes capacity monitoring compares Unitrode's gas-gauge solutions to microprocessor-based implementations describes device operation in general terms and addr

DN303 -- Cleanup of Installed PC Tools

This application report discusses the power consumption of the Texas Instruments C6747/45/43. Power consumption on the C6747/45/43 devices are highly application-dependent so a spreadsheet is provided to model power consumption for a user's application. To obtain good results from the spreadsheet realistic usage parameters must be entered. The low-core voltage and other power design optimization

Understanding the input and output limitations of an instrumentation amplifier (IA) is important in interfacing a resistive bridge sensor to the PGA900. Adjusting the common mode voltage of the input

This application report describes a design example that uses fast TPS5625 hysteretic controller and low-cost TL5001A PWM controller installed in SLVP105 and SLVP101 EVMs for a TMS320C6201 DSP application. This design converts 5 V to 2.5 V at 8 A and 3.3 V at 3 A for high-current DSP applications.

This application note addresses a method to OR the high side of the power source as well as the low side using N-channel MOSFETs, thus replacing diodes D1 and D2 with more efficient MOSFETs in the hig

DRV8802, DRV8812, DRV8813, DRV8814, DRV8828, DRV8829, DRV8840 Selecting among DRV88xx devices to drive Brushed or Stepper Motors

Customers have evaluated several TI power-management (PMU) devices and have found that somedesigns can make the PMUs operate beyond typical data-sheet application specifications. This reportreviews the backgrounds of various relevant design features of a family of 5-V CMOS sub-PMUssuggests solutions to accommodate system requirements mitigates radiation concerns and proposesbest practic

The TPS61140/1 is a dual output boost converter providing regulated voltage and current output with one boost converter. The reference design and application example shown in this document can be used

This document describes the design considerations required to change a bq2084 design to a bq2084-V133 solution. Find the latest ordering information and data sheet on the World Wide Web at http://powe

This document describes issues of interest related to migration from the TMS320VC5410 to the TMS320VC5410A. The objective of this document is to indicate differences between the two devices. Functions that are identical between the two devices are not included. For detailed information on the specific functions of either device refer to the device data sheets 5410 (SPRS075) 5410A (SPRS139) the

CC1120 CC1121 CC1125 CC1175 CC1200 CC1201 CC1111 CC1101 CC1110 CC110L Miniature Helical PCB Antenna for 868 MHz or 915/920 MHz CC113L CC115L

This gold(Au) embrittlement study evaluates TI?s original four-layer nickel-palladium(NiPd) lead finish that was introduced in 1989 and TI?s nickel-palladium-gold(NiPdAu) lead finish that replaced four-layer NiPd in 2001. Samples were prepared with three different Au thicknesses for the NiPdAu components. The printed wiring board(PWB) finishes used were organic solderability preservative(OSP) and

6A Termination Supply Tracks 1/2 Core Voltage

Power consumption on an Ethernet PHY is affected by different operating conditions. System design around Ethernet products requires accurate power consumption numbers for component selection thermal management and power distribution planning. This application report details power consumption of DP83867 in different conditions.