LABOR CARD FR4 RM 2 50 MM; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Copper ;RoHS Compliant: Yes

PCB EUROCARD FR2 100X160; Board Type:Eurocard; Board Material:Epoxy Paper; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:DIN41612 Type D; Copper Coating Density:Organic Surface Protection 0 30 µm; Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:37 x 57; Hole Pitch:2.54mm; Material:SRBP FR2; No. of Copper Coated Sides:1; No. of Holes:2109; PCB Size:100 x 160 mm; Pad Area:2.10 mm Ø; Pad Diameter:2.1mm; Pitch Spacing:2.54mm

ADAPTOR QFP 144 160 100 132 164; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:Prototype Board; Copper Coating Density:35 um 2-side; External Height:63.4mm; External Width:64.1mm; Hole Diameter:1mm; Hole Matrix:Adaption for QFP 144 160 (0.65 mm) and QFP 100 132 164 (0.635 mm); No. of Copper Coated Sides:2

ADAPTOR QFP 72 12; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:Prototype Board; Copper Coating Density:35 um 2-side extremly planar; External Height:43mm; External Width:43mm; Hole Diameter:1mm; Hole Matrix:Adaption for QFP 72 100 (0.50 mm) and QFP 12 (0.40 mm)

Epoxy fibre-glass FR4 1.50 mm, Double-sided 35 m Cu, Plated through holes (PTH), Size 73.66 x 73.66 mm

ADAPTOR SMD 0.65MM 16-36PIN; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:TSOP-1 16-36 Pin; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:16.5mm; External Length / Height:16.5mm; External Width:43.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:36; PCB Size:43.5 x 16.5 mm; Pad Diameter:1.5mm

PCB MULTIADAPTOR SOT-23 ; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SOT TO SC; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:22.86mm; External Length / Height:22.86mm; External Width:46.72mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Size:22 86 x 46 72 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm

IC ADAPTOR FIBREGLASS SOT-23-3; Convert From:3-SOT-23; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS SC70/88/SOT363-6; Convert From:6-SC70 / SC-88 / SOT-363; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; SVHC:No SVHC (17-Dec-2015)

IC ADAPTOR FIBREGLASS SDIP-64; Convert From:64-SDIP; Convert To:-; Pitch Spacing:1.78mm; Row Pitch:19.05mm; Product Range:-; SVHC:No SVHC (17-Dec-2015)

ADAPTOR SMD SSOP-14 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-14; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:13mm; External Length / Height:13mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:14; PCB Size:13.0 x 23.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD SSOP-20 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-20; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:20mm; External Length / Height:20mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:20; PCB Size:20.0 x 23.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD FR4 SSOP-28 0.65MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-28; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:23.5mm; External Length / Height:13mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:28; PCB Size:13.0 x 23.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD SSOP-48 0.635MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-48; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:29.5mm; External Length / Height:29.5mm; External Width:32.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:48; PCB Size:32.5 x 29.5 mm; Pad Diameter:1.5mm

ADAPTOR SMD SSOP-56 0.635MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SSOP-56; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:29.5mm; External Length / Height:29.5mm; External Width:37.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:56; PCB Size:37.5 x 29.5 mm; Pad Diameter:1.5mm

MULTI-ADAPTOR 11.5X16MM SOIC-8; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SOIC-8; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:16mm; External Width:11.5mm; Hole Diameter:1mm

ADAPTOR SMD SO-14 1.27MM; Pitch Spacing:1.27mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-14; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Thickness:35µm; External Height:13.5mm; External Width:20.5mm; Hole Diameter:1mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:14

MULTI-ADAPTOR 16X21.6MM SOIC-14; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SOIC-14; Board Material:Epoxy Glass Composite; Board Type:Prototype Board; External Height:21.6mm; External Width:16mm; Hole Diameter:1mm

MULTIADAPTOR SMD SOIC-16; Convert From:16-SOIC; Convert To:-; Pitch Spacing:1.27mm; Row Pitch:-; Product Range:-; SVHC:No SVHC (17-Dec-2015)

ADAPTOR SMD SO-16W 1.27MM; Pitch Spacing:2.54mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Board Connector / Footprint:SO-16W; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Height:13.5mm; External Length / Height:13.5mm; External Width:25.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:16; PCB Size:25.5 x 13.5 mm; Pad Diameter:1.5mm