ADHESIVE, EPOXY-2 PART, BEIGE, 30MPA;

ADHESIVE EPOXY TOUGHENED SEMI RIGID; Adhesive Type:Epoxy; Dispensing Method:Cartridge; Adhesive Colour:Black; Weight:50g; Product Range:-; Volume:-; Adhesive Applications:Bonding General Purpose; Weight Min:50g

ADHESIVE EPOXY 5 MIN. HIGH STRENGTH; Adhesive Type:-; Dispensing Method:Cartridge; Adhesive Colour:Yellow; Weight:50g; Product Range:-; Volume:-; Adhesive Applications:Bonding General Purpose; Weight Min:50g

ENCAPSULANT MARINE GRADE PU 2K 250G; Potting Compound Type:PUR (Polyurethane); Dispensing Method:Packet; Compound Colour:-; Weight:-; Product Range:-; Volume:-; Colour:Black

EPOXY TWIN PACK 25ML; Adhesive Type:Epoxy; Dispensing Method:Packet; Adhesive Colour:Transparent; Weight:-; Product Range:-; Volume:25ml

POLYURETHANE RED CARTRIDGE 250ML; Potting Compound Type:PUR (Polyurethane); Dispensing Method:Cartridge; Compound Colour:Red; Weight:-; Product Range:-; Volume:250ml; Elongation:60%; Operating Temperature Max:120°C; Operating Temperature Min:-55°C; Specific Gravity:1.02

ENCAPSULANT EPOXY FLAM RETARD 50G; Potting Compound Type:Epoxy; Dispensing Method:Packet; Compound Colour:Black; Weight:50g; Product Range:PX804D Series; Volume:-; Colour:Black; Cure Time Max:24h; Cure Time Min:1h; Mix Ratio:8.6:1; Mix Ratio by Volume:4.8:1; Shelf Life:1Yr; Specific Gravity:1.7; Storage Temperature Max:25°C; Storage Temperature Min:10°C; Viscosity:9Pa·s @ 25°C

ENCAPSULANT EPOXY FLAM RETARD 100G; Potting Compound Type:Epoxy; Dispensing Method:Packet; Compound Colour:Black; Weight:100g; Product Range:PX804D Series; Volume:-; Colour:Black

ENCAPSULANT EPOXY THERMAL COND 250G; Potting Compound Type:Epoxy; Dispensing Method:Sachet; Compound Colour:White; Weight:250g; Product Range:-; Volume:-; Colour:White; Cure Time Max:24h; Cure Time Min:2h; Mix Ratio:13.8:1; Mix Ratio by Volume:6.2:1; Operating Temperature Max:80°C; Operating Temperature Min:25°C

RESIN P/THANE VERY LOW VISCOSITY; Potting Compound Type:PUR (Polyurethane); Dispensing Method:Packet; Compound Colour:Black; Weight:500g; Product Range:-; Volume:-; Colour:Black; Cure Time Min:10min; Operating Temperature Max:110°C; Operating Temperature Min:-40°C; Resistivity:16ohm/sq; Shore Hardness:70; Weight Min:500g

RESIN P/THANE SEMIRIGID LOW VISC; Potting Compound Type:PUR (Polyurethane); Dispensing Method:Packet; Compound Colour:Grey; Weight:500g; Product Range:-; Volume:-; Colour:Grey; Conductivity:0.3W/mK; Dielectric Strength:100V/m; Mix Ratio:7.83:1; Mix Ratio by Volume:6.4:1; Operating Temperature Max:100°C; Shore Hardness:80; Useable Life:20mins @25deg; Viscosity:2.5Pa·s; Weight Min:500g

RESIN POLYURETHANE TWIN PACK 566G; Potting Compound Type:PUR (Polyurethane); Dispensing Method:Packet; Compound Colour:Black; Weight:566g; Product Range:-; Volume:-; Conductivity:0.42 w/mk; Dielectric Strength:16.2V/m; Mix Ratio:8.5:1; Mix Ratio by Volume:6.0:1; Operating Temperature Max:100°C; Shore Hardness:60; Useable Life:10mins; Viscosity:13Pa·s

POTTING COMPOUND, PACKET, BLACK, 250G;

POTTING COMPOUND, PACKET, BLACK 1KG;

ENCAPSULANT EPOXY FLAM RETARD 1000G; Potting Compound Type:Epoxy; Dispensing Method:Packet; Compound Colour:Black; Weight:1kg; Product Range:PX700K-1 Series; Volume:-

ENCAPSULANT 2K FLEX PU GP MARINE 250G; Potting Compound Type:PUR (Polyurethane); Dispensing Method:Packet; Compound Colour:Black; Weight:-; Product Range:-; Volume:-; Colour:Black; Operating Temperature Max:125°C; Operating Temperature Min:-55°C