Description

ENCAPSULANT EPOXY THERMAL COND 250G; Potting Compound Type:Epoxy; Dispensing Method:Sachet; Compound Colour:White; Weight:250g; Product Range:-; Volume:-; Colour:White; Cure Time Max:24h; Cure Time Min:2h; Mix Ratio:13.8:1; Mix Ratio by Volume:6.2:1; Operating Temperature Max:80°C; Operating Temperature Min:25°C