PASSIVE COOLING SOLUTION FOR COM EXPRESS MINI TYPE10 MODULE CONGA-MA7 WITH LIDDED INTEL ATOM X6000E PROCESSORS. ALL STANDOFFS ARE WITH 2.7MM BORE HOLE.
STANDARD HEATSPREADER FOR COM EXPRESS TYPE 7 MODULE CONGA-B7XD WITH INTEGRATED COPPER PLATE AND 11MM OVERALL HEIGHT. * CU = COPPER PLATE * B = 2.7MM BORE HOLE STANDOFFS
COM EXPRESS MINI TYPE10 MODULE WITH INTEL ATOM X6425E QUAD CORE PROCESSOR WITH 1.8GHZ CORE FREQUENCY UP TO 3.0GHZ, 1.5MB CACHE, 16GB 3733MT/S LPDDR4X ONBOARD MEMORY AND 64GB UFS 2.0 ONBOARD FLASH.