SMARC 2.1 MODULE WITH HIGH PERFORMANCE NXP I.MX 8 QUADMAX PROCESSOR WITH 2X ARM CORTEX-A72, 4X ARM CORTEX-A53 AND 2X ARM CORTEX-M4F, 4GB ONBOARD LPDDR4 MEMORY AND 16GB ONBOARD EMMC. INDUSTRIAL TEMPERA
STANDARD PASSIVE COOLING SOLUTION FOR HIGH PERFORMANCE COM EXPRESS MODULES CONGA-TS170/TS175/TS370 WITH INTEGRATED HEAT PIPES, 15MM SILVER FINS AND 20MM OVERALL HEAT SINK HEIGHT. ALL STANDOFFS ARE WIT
PASSIVE COOLING SOLUTION FOR COM EXPRESS MINI TYPE10 MODULE CONGA-MA5 WITH OPEN SILICON INTEL PENTIUM AND CELERON PROCESSOR. ALL STANDOFFS ARE M2.5MM THREAD.