Thermal Substrates - MCPCB 1 X 17 SQ. STRIP SAMSUNG SUNNIX

Thermal Substrates - MCPCB 1 X 17 SQ. STRIP SAMSUNG SUNNIX

Thermal Interface Pad, Thin Film Polyimide, 0.9W/m·K, 28.96 x 20.57mm 0.152mm, Self-Adhesive. Length: 28.96mm. Self-Adhesive: Yes. Minimum Operating Temperature: -60°C. Maximum Operating Temperature: +180°C. Hardness: Shore A 90. Material Trade Name: Sil-Pad K4. Operating Temperature Range: -60 → +180 °C. MPN: SPK4-0.006-AC-122, Bergquist

Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, Q-Pad II, 12" x 12" Sheet, 0.006" Thickness, Adhesive - One Side

Thermal Interface Sheet, Q-Pad II, 2.5W/m·K, 12 x 12in 0.152mm. Minimum Operating Temperature: -60°C. Maximum Operating Temperature: +180°C. Hardness: Shore A 93. Operating Temperature Range: -60 → +180 °C. MPN: QII-0.006-00-1212, Bergquist

Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, Q-Pad II, 12" x 12" Sheet, 0.006" Thickness, Adhesive - One Side

Thermal Interface Products Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material, Gap Pad 3000S30, 8" x 16" Sheet, 0.010" Thickness

Thermal Interface Products SIL PAD 900 .009" .750x.500x.187x.125

THERMAL PAD TO-220 .006" K4

Thermal Interface Products GAPPAD HC5.0 .060" 8X16"

Thermal Interface Products GAPPAD HC5.0 .020" 8X16"

Thermal Interface Products SILPAD900S .009" 12X12 SHEET

Thermal Interface Products

Thermal Interface Products SIL PAD 400 .007" 1.65x1.14x.14x.093

Thermal Interface Products SIL PAD 400 .009" .687x.562x.125

Thermal Interface Products SIL PAD 900 .009" .860x.740x.20x.16

Thermal Interface Products Q-PAD .005" 1.00x.75x.30x.14

Thermal Interface Products SIL PAD 900 .009" 1.45x.838x.17

Bergquist Company

Thermal Interface Products GAPPAD 1500R .015" 8X16"