Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, 12" x 12" Sheet, 0.006" Thickness, Sil-Pad TSP Q2500 Series / Also Known as Bergquist Q-Pad II Series

Thermal Interface Products Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material, Gap Pad 3000S30, 8" x 16" Sheet, 0.010" Thickness

Thermal Interface Pad, Thin Film Polyimide, 0.9W/m·K, 28.96 x 20.57mm 0.152mm, Self-Adhesive. Length: 28.96mm. Self-Adhesive: Yes. Minimum Operating Temperature: -60°C. Maximum Operating Temperature: +180°C. Hardness: Shore A 90. Material Trade Name: Sil-Pad K4. Operating Temperature Range: -60 → +180 °C. MPN: SPK4-0.006-AC-122, Bergquist

Thermal Interface Sheet, Q-Pad II, 2.5W/m·K, 12 x 12in 0.152mm. Minimum Operating Temperature: -60°C. Maximum Operating Temperature: +180°C. Hardness: Shore A 93. Operating Temperature Range: -60 → +180 °C. MPN: QII-0.006-00-1212, Bergquist

Thermal Interface Products Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material, 8" x 16" Sheet, 0.010" Thickness, Gap Pad TGP 3000 Series / Also Known as Bergquist Gap Pad 3000S30 Series

Thermal Interface Products Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material, 8" x 16" Sheet, 0.010" Thickness, Gap Pad TGP 3000 Series / Also Known as Bergquist Gap Pad 3000S30 Series

Thermal Interface Products Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material, 8" x 16" Sheet, 0.010" Thickness, Gap Pad TGP 3000 Series / Also Known as Bergquist Gap Pad 3000S30 Series

Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, 12" x 12" Sheet, 0.006" Thickness, Adhesive - One Side, Sil-Pad TSP Q2500 Series / Also Known as Bergquist Q-Pad II Series

Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, 12" x 12" Sheet, 0.006" Thickness, Adhesive - One Side, Sil-Pad TSP Q2500 Series / Also Known as Bergquist Q-Pad II Series

Thermal Interface Products Electrically Insulating, Thermally Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1600P Series / Also Known as Bergquist Hi-Flow 300P Series

Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, Q-Pad II, 12" x 12" Sheet, 0.006" Thickness, Adhesive - One Side

Thermal Substrates - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Square Strip (17-up)

Thermal Interface Products Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material, 8" x 16" Sheet, 0.010" Thickness, Gap Pad TGP 3000 Series / Also Known as Bergquist Gap Pad 3000S30 Series

Thermal Interface Products Electrically Insulating, Thermally Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1600P Series / Also Known as Bergquist Hi-Flow 300P Series

Bergquist Company BERGQUIST GAP PAD TGP 6000ULM

SIL-PAD K-6, .006", 12"X12" SHEET; INSULATOR BODY MATERIAL:POLYIMIDE FILM MT FILM; THERMAL CONDUCTIVITY:1.1W/M.K; BREAKDOWN VOLTAGE VBR:6000V; THICKNESS:0.152MM; VOLUME RESISTIVITY:1000000MOHM-M ROHS COMPLIANT: YES

Thermal Liquid Gap Filler, 2 Part 50cc Cartridge

Thermal Interface Products Sil-Pad, 12x12 Inch Sheet, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II

Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, 12" x 12" Sheet, 0.006" Thickness, Sil-Pad TSP Q2500 Series / Also Known as Bergquist Q-Pad II Series, IDH 2191868

Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, 12" x 12" Sheet, 0.006" Thickness, Sil-Pad TSP Q2500 Series / Also Known as Bergquist Q-Pad II Series, IDH 2191868