112165
Part Number : 112165
BergquistThermal Pad Beige 304.80mm x 292.10mm Rectangular Adhesive - One Side
SIL PAD TSP 3500
Part Number : SIL PAD TSP 3500
BergquistSIL-PAD 2000, .015", 6"X6" SHEET; Insulator Body Material: Fibreglass, Silicone Elastomer; Thermal Conductivity: 3.5W/m.K; Breakdown Voltage Vbr: 4kV; Thickness: 0.38mm; Volume Resistivity: 10ohm-m; Thermal Impedance: 0.57°C/W
GAP PAD TGP 1000VOUS
Part Number : GAP PAD TGP 1000VOUS
BergquistGAP PAD VO-U/S, .200", 4"X4" SHEET; Thermal Conductivity: 1W/m.K; Conductive Material: -; Thickness: 5.08mm; Thermal Impedance: -; Dielectric Strength: -; External Length: -; External Width: 100mm; Product Range: -; SVHC: No SVHC
BOND PLY TBP 850
Part Number : BOND PLY TBP 850
BergquistBOND-PLY 100, .005", 1"X1", PK10; Thermal Conductivity: 0.8W/m.K; Conductive Material: -; Thickness: 0.005"; Thermal Impedance: -; Dielectric Strength: -; External Length: -; External Width: 25mm; Product Range: -; SVHC: No SVHC
SIL PAD TSP 1800
Part Number : SIL PAD TSP 1800
BergquistSIL-PAD 1200 .009" 12"X12" SHEET; Insulator Body Material: -; Thermal Conductivity: 1.8W/m.K; Breakdown Voltage Vbr: 6kV; Thickness: 0.229mm; Volume Resistivity: 1000Mohm-m; Thermal Impedance: -; Dielectric Strength: -; Product
SIL PAD TSP 1800ST
Part Number : SIL PAD TSP 1800ST
BergquistSIL-PAD 1500ST .008" 4" X 4" SHEET; Insulator Body Material: -; Thermal Conductivity: 1.8W/m.K; Breakdown Voltage Vbr: 3kV; Thickness: 0.203mm; Volume Resistivity: 100000Mohm-m; Thermal Impedance: -; Dielectric Strength: -; Pr
GP3000S30-0.010-02-0816-NA
Part Number : GP3000S30-0.010-02-0816-NA
BergquistThermal Interface Products GAP PAD, Conductive, Soft, 8"x16" Sheet, 0.010" Thickness, TGP3000/3000S30
804069
Part Number : 804069
BergquistLED Heat Sinks & Thermal Substrates Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series
