Description

WinLink E850-96 Board is a 96Boards CE HW Specification V2.0 Development Board based on Samsung Exynos 850 Mobile processor, developed by WinLink.

Exynos 850 is manufactured on 8nm low-power FinFET process design, high performance optimized Little Cortex-A55 Octa micro-processor for smart phone and tablet applications and also for embedded gadgets.

The Exynos 850 enables high-quality display resolutions, support for up to FHD+ (2520x1080) resolution, sharp video on their devices. The Exynos 850 processer also contains the HEVC (High Efficiency Video Coding) codec, which enables FHD(1920X1080) 60fps encoding and decoding simultaneously.

Exynos 850 provides the Mali-G52 GPU with wide range of APIs such as OpenGL ES1.1/2.0/3.2, OpenCL 2.0 Full Profile and Vulkan 1.0/1.1. Video processing supports FHD+(1080x2520) resolution.

WinLink E850-96 Board is 100mm x 85mm in size, 96 Boards CE(Consumer Edition) Extended version including NPU.