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Application Notes

Automating Audio Bluetooth Connectivity Using NFC Secure Simple Pairing

Texas Instruments
The NFC Forum and the Bluetooth® Special Interest Group (SIG) collaborated to produce an application document entitled NFC Forum Bluetooth Secure Simple Pairing Using NFC Application Document located at NFCForum-AD-BTSSP_1.0. This collaborative document is a follow up to a previously released specification by the NFC Forum entitled NFC Forum Connection Handover Specification which began t

AN027 -- Temperature Compensation

Texas Instruments
AN027 -- Temperature Compensation

TRF370417: Optimizing OIP3 performance at LO frequencies beyond 4.5GHz

Texas Instruments
TRF370417 TRF370417: Optimizing OIP3 performance at LO frequencies beyond 4.5GHz

Minimizing FET Losses For a High Input Rail Buck Converter (Rev. A)

Texas Instruments
Engineers often face the challenge of choosing the input voltage rail that works best for the DC-DCconverter at the point-of-load (POL). High voltage rails above 12 V usually demand intermediateregulation stages that reduce overall efficiency and add to cost. However the new generation of regulatorand controller ICs afford POL regulation from these high input rails directly. Typically the

Performing Accurate PFM Mode Efficiency Measurements

Texas Instruments
When performing measurements on DC-DC converters using pulse frequency modulation (PFM), proper care must be taken to ensure that the measurements are accurate. Due to the nature of a converter operat

Flash Read Error and Susceptibility for MSP430F54xxA

Texas Instruments
Flash Read Error and Susceptibility for MSP430F54xxA

FET Switches in Docking Stations

Texas Instruments
Docking stations for portable electronics require the capability to connect a system with a live-running bus to a disabled or powered-down system. This hot-docking event must not cause any electrical damage electrical signal glitches or data corruption. This application report explains the use of TI FET bus-switch products with precharge to accomplish this connection.

TVP5160 PCB Layout Guidelines

Texas Instruments
TVP5160 PCB Layout Guidelines

Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. A)

Texas Instruments
Due to rapid migration to lower power-supply voltages, bus translators often are necessary as an interface between separately powered components of a logic system. This application report discusses th

TMS320VC5471/TMS320VC5470 Inter-Processor Communication

Texas Instruments
The TMS320VC547x (VC547x) generation of devices including the TMS320VC5470 and the TMS320VC5471 has a master TMS470R1x (ARM7TDMIE) microcontroller unit (MCU) CPU with a slave TMS320C54x™ (C54x™) digital signal processor (DSP) CPU. Inter-processor communication (IPC) between the two processors can be performed using various methods. This document describes an interrupt-driven method o

AM35x High-End CAN Controller (HECC) Overview

Texas Instruments
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:<p> <a href=http://processors.wiki.ti.com/index.php/AM35x_Hi

Metastable Response In 5-V Logic Circuits

Texas Instruments
This document describes metastable response in digital circuits. After a definition of a metastable state a test circuit is provided its responses analyzed and test results given. Examples show the influence of metastability on the response of asynchronous circuits and measures for improving reliability are assessed.

Noise Sources In Applications Using Capacitive Coupled Isolated Amplifier

Texas Instruments
Noise is a typical problem confronting many isolation applications. Isolation products such as analog isolation amplifiers optocouplers transformers and digital couplers are used in applications to transmit signals across a high voltage barrier while providing galvanic separation between two grounds.

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