The TPIC6C596 can be used to switch a variety of low-side loads. Some loads induce transients that can be coupled onto components and traces that can feed back into the control circuits of the TPIC6C596. While the device is designed to minimize interference from external noise the user should plan the board layout and external component placement to help reduce interference in very noisy applicat
Texas Instruments TMSx70 microcontrollers built using TI's F035 Flash process have one or two test pins used for advanced testing of the Flash memory. This application report discusses how to utilize these pins when designing circuit boards for one of these processors.
This application report presents various system designs possible using the FlatLink? transmitter: SN75LVDS83B, and the FlatLink? receivers: SN75LVDS82 and SN75LVDS86A. These are low-voltage differen
This application report describes how to communicate with the Hercules™ serial peripheral interface (SPI) bootloader. The SPI bootloader is a small piece of code that can be programmed at the beginning of Flash to act as an application loader as well as an update mechanism for applications running on a Hercules Cortex™-R4 based TMS570LS12x microcontroller.
There is an increasing demand to bring video and image processing capabilities to devices like video IP phones cellular phones and personal data assistants (PDAs). The images are brought to the user on liquid crystal displays that usually use thin film transistor (TFT) technology. These LCD devices require very specific timings and row/column formatting that can make them difficult to directly i
This design note describes a demo board for the UC3853 8-pin High Power-Factor Preregulator Integrated Circuit. This demo board was designed for 100W 75kHz operation over a universal input-voltage range (80VAC to 270VAC). A parts list and schematic diagram for the typical application circuit are included in this design note.
This application report provides an overview of the host side design in the Multichannel Vocoder (MCV) Technology Demonstration Kit (TDK). Emphasis is given to overall system architecture and the major system components. The MCV TDK is currently running on TMS320C6201/C6701 EVMs. All algorithm components are compliant with the eXpressDSP Algorithm Standard and are run-time configurable.The MCV
This application report discusses a way to increase the efficiency of the boost converter in a backlightdriver by reducing conduction and AC losses in the inductor thereby increasing the overall efficiency ofthe backlight driver at higher loads.
This application report describes the implementation of a single-phase electronic electricity meter using the Texas Instruments MSP430AFE25x metrology family of processors in two-chip architecture. The metering processor (MSP430AFE25x) assumes the role of a slave controlled by a host microcontroller (MCU) the MSP430F663x.
Thermal impedance (junction to ambient) is one of several indices reported to reflect the thermal performance of a package. This document shows the impact of the wind-tunnel k-factor test-board design parameters on thermal impedance results. It presents a software modelling approach using the THEATACAL software package. The design and results are provided with an analysis of the variance. Verifica
The availability of dual and quad packaged FET op amps offers the designer all the traditional capabilitiesof FET op amps including low bias current and speed and some additional advantages. The cost-peramplifieris lower because of reduced package costs. This means that more amplifiers are available toimplement a function at a given cost making design easier. At the same time the availab
This application report describes the parallelization and optimization of a hydraulic simulator kernel on a Texas Instruments (TI?) TMS320C40 multi-DSP (digital signal processor) platform. Research is
The new dual low-drop-out (LDO) regulators on the TPS767D325 are custom designed to supply the latest DSP core and I/O system supply voltages. But the LDO regulators on this IC meet more than their new voltage requirements; specifically they enable faster supply current transient capability. This family of LDOs also includes the TPS767D318 and TPS767D301. This new family of 2-A regulators also ac
This document is intended to show the integration into and operation of the Bluetopia® Bluetooth™ Protocol Stack and Profiles within the bounds of the eXpressDSP software Reference Framework Level 3 (RF3). This integration incorporates a serial transport layer and Stonestreet One?s (SS1) existing Bluetopia core stack and Hands-Free and Headset profiles IP with the framework defined by RF